Issued Patents All Time
Showing 76–100 of 201 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9309604 | Method and apparatus for electroplating | Jingbin Feng, Zhian He, Jonathan D. Reid, Seshasayee Varadarajan | 2016-04-12 |
| 9260793 | Electroplating apparatus for tailored uniformity profile | David W. Porter, Bryan L. Buckalew, Robert Rash | 2016-02-16 |
| 9221081 | Automated cleaning of wafer plating assembly | Thomas A. Ponnuswamy, Lee Peng Chua, Robert Rash | 2015-12-29 |
| 9139927 | Electrolyte loop with pressure regulation for separated anode chamber of electroplating system | Robert Rash, Richard Abraham, David W. Porter | 2015-09-22 |
| 9109295 | Electrolyte concentration control system for high rate electroplating | Jonathan D. Reid, Seshasayee Varadarajan | 2015-08-18 |
| 9074286 | Wet etching methods for copper removal and planarization in semiconductor processing | Eric G. Webb, David W. Porter | 2015-07-07 |
| 9074287 | Reduced isotropic etchant material consumption and waste generation | David W. Porter | 2015-07-07 |
| 9045841 | Control of electrolyte composition in a copper electroplating apparatus | Bryan L. Buckalew, Jonathan D. Reid, John Sukamto, Zhian He, Seshasayee Varadarajan | 2015-06-02 |
| 8992757 | Through silicon via filling using an electrolyte with a dual state inhibitor | Mark J. Willey | 2015-03-31 |
| 8962085 | Wetting pretreatment for enhanced damascene metal filling | David W. Porter, Mark J. Willey | 2015-02-24 |
| 8883640 | Sequential station tool for wet processing of semiconductor wafers | Evan E. Patton, Theodore Cacouris, Eliot K. Broadbent | 2014-11-11 |
| 8858774 | Electroplating apparatus for tailored uniformity profile | David W. Porter, Bryan L. Buckalew, Robert Rash | 2014-10-14 |
| 8795480 | Control of electrolyte hydrodynamics for efficient mass transfer during electroplating | David W. Porter | 2014-08-05 |
| 8795482 | Selective electrochemical accelerator removal | Marshall R. Stowell, John Drewery, Richard S. Hill, Timothy M. Archer, Avishai Kepten | 2014-08-05 |
| 8703615 | Copper electroplating process for uniform across wafer deposition and void free filling on ruthenium coated wafers | Thomas A. Ponnuswamy, John Sukamto, Jonathan D. Reid, Huanfeng Zhu | 2014-04-22 |
| 8623193 | Method of electroplating using a high resistance ionic current source | Jonathan D. Reid | 2014-01-07 |
| 8603305 | Electrolyte loop with pressure regulation for separated anode chamber of electroplating system | Robert Rash, Richard Abraham, David W. Porter | 2013-12-10 |
| 8597461 | Reduced isotropic etchant material consumption and waste generation | David W. Porter | 2013-12-03 |
| 8540857 | Plating method and apparatus with multiple internally irrigated chambers | Shantinath Ghongadi, Kousik Ganesan, Zhian He, Jingbin Feng | 2013-09-24 |
| 8530359 | Modulated metal removal using localized wet etching | David W. Porter | 2013-09-10 |
| 8513124 | Copper electroplating process for uniform across wafer deposition and void free filling on semi-noble metal coated wafers | Thomas A. Ponnuswamy, John Sukamto, Jonathan D. Reid | 2013-08-20 |
| 8500985 | Photoresist-free metal deposition | John Drewery, Eric G. Webb | 2013-08-06 |
| 8500983 | Pulse sequence for plating on thin seed layers | Thomas A. Ponnuswamy, Bryan Pennington, Clifford Raymond Berry, Bryan L. Buckalew | 2013-08-06 |
| 8481432 | Fabrication of semiconductor interconnect structure | Daniel A. Koos, Eric G. Webb | 2013-07-09 |
| 8475644 | Method and apparatus for electroplating | Jingbin Feng, Zhian He, Jonathan D. Reid, Seshasayee Varadarajan | 2013-07-02 |