Issued Patents All Time
Showing 126–150 of 201 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7799200 | Selective electrochemical accelerator removal | John Drewery, Richard S. Hill, Timothy M. Archer, Avishai Kepten | 2010-09-21 |
| 7780867 | Edge bevel removal of copper from silicon wafers | Seshasayee Varadarajan, Douglas A. Preston | 2010-08-24 |
| 7690324 | Small-volume electroless plating cell | Jingbin Feng, Daniel Mark Dinneen, Edmund Minshall, Christopher M. Bartlett, Eric G. Webb +6 more | 2010-04-06 |
| 7686935 | Pad-assisted electropolishing | Julia Svirchevski, John Drewery | 2010-03-30 |
| 7686927 | Methods and apparatus for controlled-angle wafer positioning | Jonathan D. Reid, Seshasayee Varadarajan, David Craig Smith, Evan E. Patton, Dinesh S. Kalakkad +2 more | 2010-03-30 |
| 7682498 | Rotationally asymmetric variable electrode correction | John Drewery | 2010-03-23 |
| 7622024 | High resistance ionic current source | Jonathan D. Reid | 2009-11-24 |
| 7605082 | Capping before barrier-removal IC fabrication method | Jonathan D. Reid, Eric G. Webb, Edmund Minshall, Avishai Kepten, R. Marshall Stowell | 2009-10-20 |
| 7560016 | Selectively accelerated plating of metal features | John Drewery | 2009-07-14 |
| 7531463 | Fabrication of semiconductor interconnect structure | Daniel A. Koos, Heung Lak Park, Timothy Cleary, Thomas W. Mountsier | 2009-05-12 |
| 7531079 | Method and apparatus for uniform electropolishing of damascene IC structures by selective agitation | John Drewery | 2009-05-12 |
| 7449099 | Selectively accelerated plating of metal features | John Drewery | 2008-11-11 |
| 7449098 | Method for planar electroplating | Jonathan D. Reid, Mark L. Rea, Ismail Emesh, Henner Meinhold, John Drewery | 2008-11-11 |
| 7405163 | Selectively accelerated plating of metal features | John Drewery | 2008-07-29 |
| 7338908 | Method for fabrication of semiconductor interconnect structure with reduced capacitance, leakage current, and improved breakdown voltage | Daniel A. Koos, Heung Lak Park, Timothy Cleary, Thomas W. Mountsier | 2008-03-04 |
| 7211175 | Method and apparatus for potential controlled electroplating of fine patterns on semiconductor wafers | Jonathan D. Reid, Robert J. Contolini | 2007-05-01 |
| 7189647 | Sequential station tool for wet processing of semiconductor wafers | Evan E. Patton, Theodore Cacouris, Eliot K. Broadbent | 2007-03-13 |
| 7097410 | Methods and apparatus for controlled-angle wafer positioning | Jonathan D. Reid, Seshasayee Varadarajan, David Craig Smith, Evan E. Patton, Dinesh S. Kalakkad +2 more | 2006-08-29 |
| 7070686 | Dynamically variable field shaping element | Robert J. Contolini, Andrew J. McCutcheon | 2006-07-04 |
| 6967174 | Wafer chuck for use in edge bevel removal of copper from silicon wafers | Steve Taatjes, Andy McCutcheon, Jim Schall, Jingbin Feng | 2005-11-22 |
| 6964792 | Methods and apparatus for controlling electrolyte flow for uniform plating | R. Marshall Stowell, Evan E. Patton, Seshasayee Varadarajan | 2005-11-15 |
| 6946065 | Process for electroplating metal into microscopic recessed features | Vijay Bhaskaran, Evan E. Patton, Robert Jackson, Jonathan D. Reid | 2005-09-20 |
| 6919010 | Uniform electroplating of thin metal seeded wafers using rotationally asymmetric variable anode correction | — | 2005-07-19 |
| 6890416 | Copper electroplating method and apparatus | Evan E. Patton, Robert Jackson, Jonathan D. Reid | 2005-05-10 |
| 6821407 | Anode and anode chamber for copper electroplating | Jonathan D. Reid, Timothy M. Archer, Thomas Tan Vu, Seshasayee Varadarajan, Jon Henri +3 more | 2004-11-23 |