Issued Patents All Time
Showing 151–175 of 201 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6800187 | Clamshell apparatus for electrochemically treating wafers | Jonathan D. Reid, R. Marshall Stowell, Evan E. Patton, Jeff Hawkins | 2004-10-05 |
| 6793796 | Electroplating process for avoiding defects in metal features of integrated circuit devices | Jonathan D. Reid, David Craig Smith, Jon Henri, Sesha Varadarajan | 2004-09-21 |
| 6773571 | Method and apparatus for uniform electroplating of thin metal seeded wafers using multiple segmented virtual anode sources | Evan E. Patton, Brian Paul Blackman, Jonathan D. Reid, Thomas A. Ponnuswamy, Harold D. Perry | 2004-08-10 |
| 6755954 | Electrochemical treatment of integrated circuit substrates using concentric anodes and variable field shaping elements | Timothy Cleary, Michael J. Janicki, Edmund Minshall, Thomas A. Ponnuswamy | 2004-06-29 |
| 6755946 | Clamshell apparatus with dynamic uniformity control | Evan E. Patton, Jonathan D. Reid, Jeffrey A. Hawkins, Dinesh S. Kalakkad | 2004-06-29 |
| 6713122 | Methods and apparatus for airflow and heat management in electroless plating | John B. Alexy, Jingbin Feng | 2004-03-30 |
| 6709565 | Method and apparatus for uniform electropolishing of damascene ic structures by selective agitation | Robert J. Contolini, Eliot K. Broadbent, John Drewery | 2004-03-23 |
| 6664122 | Electroless copper deposition method for preparing copper seed layers | Tatyana N. Andryuschenko, Jonathan D. Reid, Eric G. Webb | 2003-12-16 |
| 6586342 | Edge bevel removal of copper from silicon wafers | Seshasayee Varadarajan, Andrew J. McCutcheon | 2003-07-01 |
| 6562204 | Apparatus for potential controlled electroplating of fine patterns on semiconductor wafers | Jonathan D. Reid, Robert J. Contolini | 2003-05-13 |
| 6551487 | Methods and apparatus for controlled-angle wafer immersion | Jonathan D. Reid, Seshasayee Varadarajan, David Craig Smith, Evan E. Patton, Dinesh S. Kalakkad +1 more | 2003-04-22 |
| 6551483 | Method for potential controlled electroplating of fine patterns on semiconductor wafers | Jonathan D. Reid, Robert J. Contolini | 2003-04-22 |
| 6537416 | Wafer chuck for use in edge bevel removal of copper from silicon wafers | Steve Taatjes, Andy McCutcheon, Jim Schall, Jinbin Feng | 2003-03-25 |
| 6527920 | Copper electroplating apparatus | Evan E. Patton, Robert Jackson, Jonathan D. Reid | 2003-03-04 |
| 6402923 | Method and apparatus for uniform electroplating of integrated circuits using a variable field shaping element | Richard Hill, Alain Harrus, Evan E. Patton, Robert J. Contolini, Steve Taatjes +1 more | 2002-06-11 |
| 6379842 | Mixed lithium manganese oxide and lithium nickel cobalt oxide positive electrodes | — | 2002-04-30 |
| 6332990 | Method for fabricating composite carbon foam | Richard W. Pekala, James L. Kaschmitter | 2001-12-25 |
| 6333275 | Etchant mixing system for edge bevel removal of copper from silicon wafers | John B. Alexy, Jinbin Feng | 2001-12-25 |
| 6315883 | Electroplanarization of large and small damascene features using diffusion barriers and electropolishing | Robert J. Contolini | 2001-11-13 |
| 6309981 | Edge bevel removal of copper from silicon wafers | Carl J. Russo, Evan E. Patton | 2001-10-30 |
| 6201924 | Disk-assisted editing for recorded video material | Stephen E. Crane, Leeann Heringer, Michael Shinsky, Gerald A. Raitzer, Michael A. Ogrinc | 2001-03-13 |
| 6007947 | Mixed lithium manganese oxide and lithium nickel cobalt oxide positive electrodes | — | 1999-12-28 |
| 5932185 | Method for making thin carbon foam electrodes | Richard W. Pekala, James L. Kaschmitter, Robert L. Morrison | 1999-08-03 |
| 5908896 | Organic aerogel microspheres | Fung-Ming Kong, Richard W. Pekala, James L. Kaschmitter | 1999-06-01 |
| 5898564 | Capacitor with a composite carbon foam electrode | Richard W. Pekala, James L. Kaschmitter | 1999-04-27 |