Issued Patents All Time
Showing 101–125 of 201 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8475637 | Electroplating apparatus with vented electrolyte manifold | Jingbin Feng, Zhian He, Robert Rash | 2013-07-02 |
| 8475644 | Method and apparatus for electroplating | Jingbin Feng, Zhian He, Jonathan D. Reid, Seshasayee Varadarajan | 2013-07-02 |
| 8470191 | Topography reduction and control by selective accelerator removal | Mark L. Rea, Richard S. Hill, Avishai Kepten, R. Marshall Stowell, Eric G. Webb | 2013-06-25 |
| 8450210 | Sequential station tool for wet processing of semiconductor wafers | Evan E. Patton, Theodore Cacouris, Eliot K. Broadbent | 2013-05-28 |
| 8419964 | Apparatus and method for edge bevel removal of copper from silicon wafers | Kousik Ganesan, Shanthinath Ghongadi, Tariq Majid, Aaron Louis LaBrie | 2013-04-16 |
| 8415261 | Capping before barrier-removal IC fabrication method | Jonathan D. Reid, Eric G. Webb, Edmund Minshall, Avishai Kepten, R. Marshall Stowell | 2013-04-09 |
| 8372757 | Wet etching methods for copper removal and planarization in semiconductor processing | Eric G. Webb, David W. Porter | 2013-02-12 |
| 8372258 | Monitoring of electroplating additives | Mark J. Willey, Lian Guo | 2013-02-12 |
| 8308931 | Method and apparatus for electroplating | Jonathan D. Reid, Bryan L. Buckalew, Zhian He, Seyang Park, Seshasayee Varadarajan +4 more | 2012-11-13 |
| 8268154 | Selective electrochemical accelerator removal | John Drewery, Richard S. Hill, Timothy M. Archer, Avishai Kepten | 2012-09-18 |
| 8262871 | Plating method and apparatus with multiple internally irrigated chambers | Shantinath Ghongadi, Kousik Ganesan, Zhian He, Jingbin Feng | 2012-09-11 |
| 8257781 | Electroless plating-liquid system | Eric G. Webb, David Mark Dinneen, Edmund Minshall, Christopher M. Bartlett, R. Marshall Stowell +6 more | 2012-09-04 |
| 8172992 | Wafer electroplating apparatus for reducing edge defects | Vinay Prabhakar, Bryan L. Buckalew, Kousik Ganesan, Shantinath Ghongadi, Zhian He +4 more | 2012-05-08 |
| 8158532 | Topography reduction and control by selective accelerator removal | Mark L. Rea, Richard S. Hill, Avishai Kepten, R. Marshall Stowell, Eric G. Webb | 2012-04-17 |
| 8147660 | Semiconductive counter electrode for electrolytic current distribution control | Jonathan D. Reid | 2012-04-03 |
| 8128791 | Control of electrolyte composition in a copper electroplating apparatus | Bryan L. Buckalew, Jonathan D. Reid, John Sukamto, Zhian He, Seshasayee Varadarajan | 2012-03-06 |
| D648289 | Electroplating flow shaping plate having offset spiral hole pattern | David W. Porter, Robert Rash | 2011-11-08 |
| 8053861 | Diffusion barrier layers | Thomas W. Mountsier, Roey Shaviv, Ronald A. Powell | 2011-11-08 |
| 8048280 | Process for electroplating metals into microscopic recessed features | Vijay Bhaskaran, Evan E. Patton, Robert Jackson, Jonathan D. Reid | 2011-11-01 |
| 8043958 | Capping before barrier-removal IC fabrication method | Jonathan D. Reid, Eric G. Webb, Edmund Minshall, Avishai Kepten, R. Marshall Stowell | 2011-10-25 |
| 8026174 | Sequential station tool for wet processing of semiconductor wafers | Evan E. Patton, Theodore Cacouris, Eliot K. Broadbent | 2011-09-27 |
| 7972970 | Fabrication of semiconductor interconnect structure | Daniel A. Koos, Eric G. Webb | 2011-07-05 |
| 7967969 | Method of electroplating using a high resistance ionic current source | Jonathan D. Reid | 2011-06-28 |
| 7947163 | Photoresist-free metal deposition | John Drewery, Eric G. Webb | 2011-05-24 |
| 7811925 | Capping before barrier-removal IC fabrication method | Jonathan D. Reid, Eric G. Webb, Edmund Minshall, Avishai Kepten, R. Marshall Stowell | 2010-10-12 |