Issued Patents All Time
Showing 26–36 of 36 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9028657 | Front referenced anode | Jingbin Feng, R. Marshall Stowell, Shantinath Ghongadi, Frederick Dean Wilmot | 2015-05-12 |
| 8540857 | Plating method and apparatus with multiple internally irrigated chambers | Steven T. Mayer, Shantinath Ghongadi, Kousik Ganesan, Jingbin Feng | 2013-09-24 |
| 8475636 | Method and apparatus for electroplating | Steven T. Mayer, Jingbin Feng, Jonathan D. Reid, Seshasayee Varadarajan | 2013-07-02 |
| 8475637 | Electroplating apparatus with vented electrolyte manifold | Jingbin Feng, Robert Rash, Steven T. Mayer | 2013-07-02 |
| 8475644 | Method and apparatus for electroplating | Steven T. Mayer, Jingbin Feng, Jonathan D. Reid, Seshasayee Varadarajan | 2013-07-02 |
| 8377268 | Electroplating cup assembly | Robert Rash, Shantinath Ghongadi, Kousik Ganesan, Tariq Majid, Jeff Hawkins +2 more | 2013-02-19 |
| 8308931 | Method and apparatus for electroplating | Jonathan D. Reid, Bryan L. Buckalew, Seyang Park, Seshasayee Varadarajan, Bryan Pennington +4 more | 2012-11-13 |
| 8262871 | Plating method and apparatus with multiple internally irrigated chambers | Steven T. Mayer, Shantinath Ghongadi, Kousik Ganesan, Jingbin Feng | 2012-09-11 |
| 8172992 | Wafer electroplating apparatus for reducing edge defects | Vinay Prabhakar, Bryan L. Buckalew, Kousik Ganesan, Shantinath Ghongadi, Steven T. Mayer +4 more | 2012-05-08 |
| 8128791 | Control of electrolyte composition in a copper electroplating apparatus | Bryan L. Buckalew, Jonathan D. Reid, John Sukamto, Seshasayee Varadarajan, Steven T. Mayer | 2012-03-06 |
| 7985325 | Closed contact electroplating cup assembly | Robert Rash, Shantinath Ghongadi, Kousik Ganesan, Tariq Majid, Jeff Hawkins +2 more | 2011-07-26 |