Issued Patents All Time
Showing 26–45 of 45 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8217513 | Remote plasma processing of interface surfaces | George Andrew Antonelli, Jennifer O'Loughlin, Tony Xavier, Mandyam Sriram, Bart J. van Schravendijk +2 more | 2012-07-10 |
| 8128791 | Control of electrolyte composition in a copper electroplating apparatus | Bryan L. Buckalew, Jonathan D. Reid, John Sukamto, Zhian He, Steven T. Mayer | 2012-03-06 |
| 8084339 | Remote plasma processing of interface surfaces | George Andrew Antonelli, Jennifer O'Loughlin, Tony Xavier, Mandyam Sriram, Bart J. van Schravendijk +2 more | 2011-12-27 |
| 7998881 | Method for making high stress boron-doped carbon films | Qingguo Wu, James S. Sims, Mandyam Sriram, Akhil Singhal | 2011-08-16 |
| 7985325 | Closed contact electroplating cup assembly | Robert Rash, Shantinath Ghongadi, Kousik Ganesan, Zhian He, Tariq Majid +2 more | 2011-07-26 |
| 7935231 | Rapidly cleanable electroplating cup assembly | Shantinath Ghongadi, Robert Rash, Jeff Hawkins, Tariq Majid, Kousik Ganesan +2 more | 2011-05-03 |
| 7906817 | High compressive stress carbon liners for MOS devices | Qingguo Wu, James S. Sims, Mandyam Sriram, Haiying Fu, Pramod Subramonium +2 more | 2011-03-15 |
| 7858510 | Interfacial layers for electromigration resistance improvement in damascene interconnects | Ananda Banerji, George Andrew Antonelli, Jennifer O'Loughlin, Mandyam Sriram, Bart J. van Schravendijk | 2010-12-28 |
| 7854828 | Method and apparatus for electroplating including remotely positioned second cathode | Jonathan D. Reid, Bryan L. Buckalew, Patrick Breiling, Glenn Ibarreta | 2010-12-21 |
| 7799671 | Interfacial layers for electromigration resistance improvement in damascene interconnects | Ananda Banerji, George Andrew Antonelli, Jennifer O'Ioughlin, Mandyam Sriram, Bart J. van Schravendijk | 2010-09-21 |
| 7799684 | Two step process for uniform across wafer deposition and void free filling on ruthenium coated wafers | Jonathan D. Reid, Seyang Park, Natalia V. Doubina | 2010-09-21 |
| 7780867 | Edge bevel removal of copper from silicon wafers | Steven T. Mayer, Douglas A. Preston | 2010-08-24 |
| 7686927 | Methods and apparatus for controlled-angle wafer positioning | Jonathan D. Reid, Steven T. Mayer, David Craig Smith, Evan E. Patton, Dinesh S. Kalakkad +2 more | 2010-03-30 |
| 7648899 | Interfacial layers for electromigration resistance improvement in damascene interconnects | Ananda Banerji, George Andrew Antonelli, Jennifer O'Loughlin, Mandyam Sriram, Bart J. van Schravendijk | 2010-01-19 |
| 7456102 | Electroless copper fill process | Jian Zhou | 2008-11-25 |
| 7097410 | Methods and apparatus for controlled-angle wafer positioning | Jonathan D. Reid, Steven T. Mayer, David Craig Smith, Evan E. Patton, Dinesh S. Kalakkad +2 more | 2006-08-29 |
| 6964792 | Methods and apparatus for controlling electrolyte flow for uniform plating | Steven T. Mayer, R. Marshall Stowell, Evan E. Patton | 2005-11-15 |
| 6821407 | Anode and anode chamber for copper electroplating | Jonathan D. Reid, Timothy M. Archer, Thomas Tan Vu, Jon Henri, Steven T. Mayer +3 more | 2004-11-23 |
| 6586342 | Edge bevel removal of copper from silicon wafers | Steven T. Mayer, Andrew J. McCutcheon | 2003-07-01 |
| 6551487 | Methods and apparatus for controlled-angle wafer immersion | Jonathan D. Reid, Steven T. Mayer, David Craig Smith, Evan E. Patton, Dinesh S. Kalakkad +1 more | 2003-04-22 |