Issued Patents All Time
Showing 26–50 of 69 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9748137 | Method for void-free cobalt gap fill | Chiukin Steven Lai, Jeong-Seok Na, Raihan M. Tarafdar, Michal Danek | 2017-08-29 |
| 9673146 | Low temperature tungsten film deposition for small critical dimension contacts and interconnects | Feng Chen, Michal Danek, Anand Chandrashekar | 2017-06-06 |
| 9653353 | Tungsten feature fill | Anand Chandrashekar, Esther Jeng, Michal Danek, Juwen Gao, Deqi Wang | 2017-05-16 |
| 9613818 | Deposition of low fluorine tungsten by sequential CVD process | Xiaolan Ba, Michal Danek, Lawrence Schloss | 2017-04-04 |
| 9595470 | Methods of preparing tungsten and tungsten nitride thin films using tungsten chloride precursor | Hanna Bamnolker, Juwen Gao, Michal Danek, Joshua Collins | 2017-03-14 |
| 9589808 | Method for depositing extremely low resistivity tungsten | Hanna Bamnolker, Deqi Wang, Yan Guan | 2017-03-07 |
| 9589835 | Method for forming tungsten film having low resistivity, low roughness and high reflectivity | Anand Chandrashekar | 2017-03-07 |
| 9548228 | Void free tungsten fill in different sized features | Anand Chandrashekar | 2017-01-17 |
| 9257302 | CVD flowable gap fill | Feng Wang, Victor Lu, Brian Lu, Wai-Fan Yau, Nerissa Draeger +4 more | 2016-02-09 |
| 9240347 | Tungsten feature fill | Anand Chandrashekar, Esther Jeng, Michal Danek, Juwen Gao, Deqi Wang | 2016-01-19 |
| 9236297 | Low tempature tungsten film deposition for small critical dimension contacts and interconnects | Feng Chen, Michal Danek, Anand Chandrashekar | 2016-01-12 |
| 9159571 | Tungsten deposition process using germanium-containing reducing agent | Sudha Manandhar, Michal Danek | 2015-10-13 |
| 9082826 | Methods and apparatuses for void-free tungsten fill in three-dimensional semiconductor features | Anand Chandrashekar, Joydeep Guha, Hua Xiang | 2015-07-14 |
| 9034760 | Methods of forming tensile tungsten films and compressive tungsten films | Feng Chen, Tsung-Han Yang, Juwen Gao, Roey Shaviv, Deqi Wang | 2015-05-19 |
| 9034768 | Depositing tungsten into high aspect ratio features | Anand Chandrashekar, Michal Danek, Aaron R. Fellis, Sean Chang | 2015-05-19 |
| 8883637 | Systems and methods for controlling etch selectivity of various materials | Esther Jeng, Anand Chandrashekar, Michal Danek, Ronald A. Powell | 2014-11-11 |
| 8853080 | Method for depositing tungsten film with low roughness and low resistivity | Yan Guan, Abhishek Manohar, Deqi Wang, Feng Chen | 2014-10-07 |
| 8835317 | Depositing tungsten into high aspect ratio features | Anand Chandrashekar, Michal Danek, Aaron R. Fellis, Sean Chang | 2014-09-16 |
| 8809161 | Flowable film dielectric gap fill process | Vishal Gauri, Chi-I Lang, Judy H. Huang, Michael Barnes, Sunil Shanker | 2014-08-19 |
| 8623733 | Methods for depositing ultra thin low resistivity tungsten film for small critical dimension contacts and interconnects | Feng Chen, Michal Danek, Anand Chandrashekar | 2014-01-07 |
| 8551885 | Method for reducing tungsten roughness and improving reflectivity | Feng Chen, Abhishek Manohar | 2013-10-08 |
| 8501620 | Method for depositing tungsten film having low resistivity, low roughness and high reflectivity | Anand Chandrashekar | 2013-08-06 |
| 8481403 | Flowable film dielectric gap fill process | Vishal Gauri, Chi-I Lang, Judy H. Huang, Michael Barnes, Sunil Shanker | 2013-07-09 |
| 8435894 | Depositing tungsten into high aspect ratio features | Anand Chandrashekar, Michal Danek, Aaron R. Fellis, Sean Chang | 2013-05-07 |
| 8409987 | Method for depositing thin tungsten film with low resistivity and robust micro-adhesion characteristics | Anand Chandrashekar, Mirko Glass, Michal Danek, Kaihan Ashtiani, Feng Chen +2 more | 2013-04-02 |