Issued Patents All Time
Showing 51–69 of 69 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8367546 | Methods for forming all tungsten contacts and lines | Kaihan Ashtiani, Karl B. Levy | 2013-02-05 |
| 8153520 | Thinning tungsten layer after through silicon via filling | Anand Chandrashekar, Michal Danek | 2012-04-10 |
| 8129270 | Method for depositing tungsten film having low resistivity, low roughness and high reflectivity | Anand Chandrashekar | 2012-03-06 |
| 8124531 | Depositing tungsten into high aspect ratio features | Anand Chandrashekar, Michal Danek, Aaron R. Fellis, Sean Chang | 2012-02-28 |
| 8119527 | Depositing tungsten into high aspect ratio features | Anand Chadrashekar, Michal Danek, Aaron R. Fellis, Sean Chang | 2012-02-21 |
| 8062977 | Ternary tungsten-containing resistive thin films | Kaihan Ashtiani, Girish Dixit, Anna Battaglia, Stefano Rassiga | 2011-11-22 |
| 8058170 | Method for depositing thin tungsten film with low resistivity and robust micro-adhesion characteristics | Anand Chandrashekar, Mirko Glass, Michael Danek, Kaihan Ashtiani, Feng Chen +2 more | 2011-11-15 |
| 8053365 | Methods for forming all tungsten contacts and lines | Kaihan Ashtiani, Karl B. Levy | 2011-11-08 |
| 7972976 | VLSI fabrication processes for introducing pores into dielectric materials | Willibrordus Gerardus Maria van den Hoek, Nerissa Draeger, Richard S. Hill, Jianing Sun, Gary W. Ray | 2011-07-05 |
| 7888233 | Flowable film dielectric gap fill process | Vishal Gauri, Chi-I Lang, Judy H. Huang, Michael Barnes, Sunil Shanker | 2011-02-15 |
| 7629224 | VLSI fabrication processes for introducing pores into dielectric materials | Willibrordus Gerardus Maria van den Hoek, Nerissa Draeger, Richard S. Hill, Jianing Sun, Gary W. Ray | 2009-12-08 |
| 7524735 | Flowable film dielectric gap fill process | Vishal Gauri, Chi-I Lang, Judy H. Huang, Michael Barnes, Sunil Shanker | 2009-04-28 |
| 7176144 | Plasma detemplating and silanol capping of porous dielectric films | Feng Wang, Michelle T. Schulberg, Jianing Sun, Patrick A. Van Cleemput | 2007-02-13 |
| 7166531 | VLSI fabrication processes for introducing pores into dielectric materials | Willibrordus Gerardus Maria van den Hoek, Nerissa Draeger, Richard S. Hill, Jianing Sun, Gary W. Ray | 2007-01-23 |
| 7074690 | Selective gap-fill process | Vishal Gauri | 2006-07-11 |
| 6905556 | Method and apparatus for using surfactants in supercritical fluid processing of wafers | Patrick Joyce, Adrianne K. Tipton, Krishnan Shrinivasan, Dennis W. Hess, Satyanarayana Myneni +1 more | 2005-06-14 |
| 6805801 | Method and apparatus to remove additives and contaminants from a supercritical processing solution | Patrick Joyce | 2004-10-19 |
| 6800142 | Method for removing photoresist and post-etch residue using activated peroxide followed by supercritical fluid treatment | Adrianne K. Tipton, Krishnan Shrinivasan, Souvik Banerjee, Patrick Joyce | 2004-10-05 |
| 6715498 | Method and apparatus for radiation enhanced supercritical fluid processing | Patrick Joyce, Vishal Gauri, Adrianne K. Tipton | 2004-04-06 |