Issued Patents All Time
Showing 26–50 of 167 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11693235 | Lens cleaning via electrowetting | Daniel Lee Revier, David Patrick Magee, Stephen John Fedigan | 2023-07-04 |
| 11676930 | Nanoparticle backside die adhesion layer | Daniel Lee Revier, Sadia Naseem, Mahmud Halim Chowdhury | 2023-06-13 |
| 11677156 | Compact high-performance device-integrated antennas | Hassan Ali, Richard Wallace, Swaminathan Sankaran, Sanjay Mohan | 2023-06-13 |
| 11676880 | High thermal conductivity vias by additive processing | Archana Venugopal, Luigi Colombo, Robert Reid Doering | 2023-06-13 |
| 11664273 | Adjusting reactive components | Paul Merle Emerson | 2023-05-30 |
| 11607704 | Methods and apparatus for electrostatic control of expelled material for lens cleaners | Daniel Lee Revier, Stephen John Fedigan, David Patrick Magee | 2023-03-21 |
| 11551986 | Shape memory polymer for use in semiconductor device fabrication | Steven Kummerl | 2023-01-10 |
| 11545466 | Multi-die module with contactless coupler and a coupling loss reduction structure | Bichoy Bahr, Baher Haroun | 2023-01-03 |
| 11522268 | Wireless device with substrate to antenna coupling | Hassan Ali | 2022-12-06 |
| 11498831 | Structures for packaging stress-sensitive micro-electro-mechanical system stacked onto electronic circuit chip | Kurt Peter Wachtler, Makoto Yoshino, Ayumu Kuroda, Brian E. Goodlin, Karen Hildegard Ralston Kirmse +2 more | 2022-11-15 |
| 11487206 | Methods and apparatus for digital material deposition onto semiconductor wafers | Daniel Lee Revier, Sean Chang, Scott R. Summerfelt | 2022-11-01 |
| 11417540 | 3D printed semiconductor package | Daniel Lee Revier | 2022-08-16 |
| 11404270 | Microelectronic device substrate formed by additive process | Daniel Lee Revier | 2022-08-02 |
| 11390527 | Multi-layered SP2-bonded carbon tubes | Nazila Dadvand, Luigi Colombo, Archana Venugopal | 2022-07-19 |
| 11387271 | Optical sensor with trench etched through dielectric over silicon | Scott R. Summerfelt, Hassan Ali | 2022-07-12 |
| 11387919 | High frequency CMOS ultrasonic transducer | Bichoy Bahr, Scott R. Summerfelt | 2022-07-12 |
| 11370662 | Hexagonal boron nitride structures | Luigi Colombo, Nazila Dadvand, Archana Venugopal | 2022-06-28 |
| 11355414 | Nanoparticle matrix for backside heat spreading | Nazila Dadvand, Daniel Lee Revier, Archana Venugopal | 2022-06-07 |
| 11320453 | Aging compensation of a ferroelectric piezoelectric shock sensor | Scott R. Summerfelt | 2022-05-03 |
| 11309388 | Multi-super lattice for switchable arrays | Luigi Colombo, Nazila Dadvand, Archana Venugopal | 2022-04-19 |
| 11296016 | Semiconductor devices and methods and apparatus to produce such semiconductor devices | Robert Allan Neidorff, Steven Kummerl, Barry Jon Male, Peter Smeys | 2022-04-05 |
| 11282807 | Nanowires plated on nanoparticles | Ralf Jakobskrueger Muenster, Sreenivasan K. Koduri | 2022-03-22 |
| 11282770 | Leadless packaged device with metal die attach | Nazila Dadvand, Sreenivasan K. Koduri | 2022-03-22 |
| 11270939 | Additively manufactured programmable resistive jumpers | Paul Merle Emerson | 2022-03-08 |
| 11264369 | Isolator integrated circuits with package structure cavity and fabrication methods | Barry Jon Male, Robert A. Neidorff, Steve Kummerl | 2022-03-01 |