Issued Patents All Time
Showing 76–100 of 167 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10892209 | Semiconductor device with metal die attach to substrate with multi-size cavity | Nazila Dadvand, Sreenivasan K. Koduri | 2021-01-12 |
| 10886187 | Thermal management in integrated circuit using phononic bandgap structure | Daniel Lee Revier | 2021-01-05 |
| 10879151 | Semiconductor package with liquid metal conductors | Dishit Paresh Parekh, Daniel Lee Revier, Jo Bito | 2020-12-29 |
| 10867880 | Multi-die module with substrate cavity assembly | Bichoy Bahr, Baher Haroun | 2020-12-15 |
| 10861796 | Floating die package | Steven Kummerl, Kurt Peter Wachtler | 2020-12-08 |
| 10861763 | Thermal routing trench by additive processing | Archana Venugopal, Luigi Colombo, Robert Reid Doering | 2020-12-08 |
| 10861715 | 3D printed semiconductor package | Daniel Lee Revier | 2020-12-08 |
| 10833648 | Acoustic management in integrated circuit using phononic bandgap structure | Daniel Lee Revier | 2020-11-10 |
| 10832993 | Packaged multichip device with stacked die having a metal die attach | Nazila Dadvand, Sreenivasan K. Koduri | 2020-11-10 |
| 10832991 | Leadless packaged device with metal die attach | Nazila Dadvand, Sreenivasan K. Koduri | 2020-11-10 |
| 10811334 | Integrated circuit nanoparticle thermal routing structure in interconnect region | Archana Venugopal, Luigi Colombo, Robert Reid Doering | 2020-10-20 |
| 10804201 | Dissimilar material interface having lattices | Archana Venugopal, Nazila Dadvand, Luigi Colombo | 2020-10-13 |
| 10801985 | Sensing capacitor with a permeable electrode | Mehmet Aslan | 2020-10-13 |
| 10790228 | Interconnect via with grown graphitic material | Archana Venugopal, Luigi Colombo, Robert Reid Doering | 2020-09-29 |
| 10788367 | Integrated circuit using photonic bandgap structure | Daniel Lee Revier | 2020-09-29 |
| 10780467 | Methods and apparatus for surface wetting control | Daniel Lee Revier, David Patrick Magee, Stephen John Fedigan | 2020-09-22 |
| 10775422 | Molecular spectroscopy cell with resonant cavity | Adam Joseph Fruehling, Juan Alejandro Herbsommer, Swaminathan Sankaran | 2020-09-15 |
| 10748999 | Multi-super lattice for switchable arrays | Luigi Colombo, Nazila Dadvand, Archana Venugopal | 2020-08-18 |
| 10723616 | Structures for packaging stress-sensitive micro-electro-mechanical system stacked onto electronic circuit chip | Kurt Peter Wachtler, Makoto Yoshino, Ayumu Kuroda, Brian E. Goodlin, Karen Hildegard Ralston Kirmse +2 more | 2020-07-28 |
| 10727085 | Printed adhesion deposition to mitigate integrated circuit package delamination | Yong Lin, Rongwei Zhang, Abram Castro | 2020-07-28 |
| 10727116 | Programming reactive components | Paul Merle Emerson | 2020-07-28 |
| 10692964 | Semiconductor die with back-side integrated inductive component | Roberto Giampiero Massolini, Daniel N. Carothers | 2020-06-23 |
| 10643944 | Additively manufactured programmable resistive jumpers | Paul Merle Emerson | 2020-05-05 |
| 10634738 | Zeeman splitting vector magnetometer apparatus and method | Juan Alejandro Herbsommer | 2020-04-28 |
| 10636778 | Isolator integrated circuits with package structure cavity and fabrication methods | Barry Jon Male, Robert A. Neidorff, Steve Kummerl | 2020-04-28 |