Issued Patents All Time
Showing 126–150 of 167 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10390433 | Methods of forming conductive and resistive circuit structures in an integrated circuit or printed circuit board | Juan Alejandro Herbsommer | 2019-08-20 |
| 10389410 | Integrated artificial magnetic launch surface for near field communication system | Nathan Brooks, Swaminathan Sankaran, Bradley Allen Kramer, Mark W. Morgan, Baher Haroun | 2019-08-20 |
| 10371891 | Integrated circuit with dielectric waveguide connector using photonic bandgap structure | Daniel Lee Revier | 2019-08-06 |
| 10374621 | Method and apparatus to reduce the leakage rate of a hermetic cavity | Juan Alejandro Herbsommer, S. Josh Jacobs | 2019-08-06 |
| 10354890 | Packaged semiconductor device having nanoparticle adhesion layer patterned into zones of electrical conductance and insulation | Yong Lin | 2019-07-16 |
| 10347508 | Printed adhesion deposition to mitigate integrated circuit delamination | Yong Lin, Rongwei Zhang, Abram Castro | 2019-07-09 |
| 10302860 | Matching impedance of a dielectric waveguide to a launching mechanism | Juan Alejandro Herbsommer | 2019-05-28 |
| 10256188 | Interconnect via with grown graphitic material | Archana Venugopal, Luigi Colombo, Robert Reid Doering | 2019-04-09 |
| 10233074 | Structures for packaging stress-sensitive micro-electro-mechanical system stacked onto electronic circuit chip | Kurt Peter Wachtler, Makoto Yoshino, Ayumu Kuroda, Brian E. Goodlin, Karen Hildegard Ralston Kirmse +2 more | 2019-03-19 |
| 10181521 | Graphene heterolayers for electronic applications | Archana Venugopal, Luigi Colombo, Robert Reid Doering | 2019-01-15 |
| 10179730 | Electronic sensors with sensor die in package structure cavity | Barry Jon Male, Robert A. Neidorff, Steve Kummerl | 2019-01-15 |
| 10170384 | Methods and apparatus providing a graded package for a semiconductor | Daniel Lee Revier | 2019-01-01 |
| 10171578 | Tapered coax launch structure for a near field communication system | Nathan Brooks, Swaminathan Sankaran, Bradley Allen Kramer, Mark W. Morgan, Baher Haroun | 2019-01-01 |
| 10147672 | Lead frame surface modifications for high voltage isolation | Yong Lin, Sadia Arefin Khan | 2018-12-04 |
| 10131115 | Hermetically sealed molecular spectroscopy cell with dual wafer bonding | Adam Joseph Fruehling, Juan Alejandro Herbsommer, Simon Joshua Jacobs | 2018-11-20 |
| 10128555 | Metallic waveguide with a dielectric core that is disposed on a non-planar or irregular surface of a substrate | Juan Alejandro Herbsommer | 2018-11-13 |
| 10121847 | Galvanic isolation device | Barry Jon Male, Robert A. Neidorff | 2018-11-06 |
| 10074639 | Isolator integrated circuits with package structure cavity and fabrication methods | Barry Jon Male, Robert A. Neidorff, Steve Kummerl | 2018-09-11 |
| 10032850 | Semiconductor die with back-side integrated inductive component | Roberto Giampiero Massolini, Daniel N. Carothers | 2018-07-24 |
| 10027376 | Guided near field communication for short range data communication | Swaminathan Sankaran, Bradley Allen Kramer, Juan Alejandro Herbsommer, Lutz Naumann, Mark W. Morgan +1 more | 2018-07-17 |
| 9985335 | Methods and apparatus for backside integrated circuit high frequency signal radiation, reception and interconnects | Swaminathan Sankaran | 2018-05-29 |
| 9941194 | Packaged semiconductor device having patterned conductance dual-material nanoparticle adhesion layer | Daniel Yong Lin | 2018-04-10 |
| 9929110 | Integrated circuit wave device and method | Barry Jon Male, Robert A. Neidorff, Steve Kummerl | 2018-03-27 |
| 9896330 | Structure and method for packaging stress-sensitive micro-electro-mechanical system stacked onto electronic circuit chip | Kurt Peter Wachtler, Makoto Yoshino, Ayumu Kuroda, Brian E. Goodlin, Karen Hildegard Ralston Kirmse +2 more | 2018-02-20 |
| 9865527 | Packaged semiconductor device having nanoparticle adhesion layer patterned into zones of electrical conductance and insulation | Yong Lin | 2018-01-09 |