Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10651151 | 3D integration using Al—Ge eutectic bond interconnect | Peter Smeys | 2020-05-12 |
| 10472231 | Assembly and packaging of MEMS device | Brian H. Kim, Haijun She | 2019-11-12 |
| 10351419 | Integrated package containing MEMS acoustic sensor and pressure sensor | Jia Gao, Brian H. Kim, Peter Hartwell | 2019-07-16 |
| 9754922 | 3D integration using Al—Ge eutectic bond interconnect | Peter Smeys | 2017-09-05 |
| 9611137 | MEMS sensor integrated with a flip chip | Peter Smeys | 2017-04-04 |
| 9508663 | Assembly and packaging of MEMS device | Brian H. Kim, Haijun She | 2016-11-29 |
| 7808223 | Transistor with spatially integrated schottky diode | Sandeep Khanna | 2010-10-05 |
| 6365482 | I.C. thin film resistor stabilization method | — | 2002-04-02 |
| 6090678 | I. C. thin film processing and protection method | — | 2000-07-18 |