Issued Patents All Time
Showing 26–43 of 43 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9378882 | Method of fabricating an electronic circuit | Richard J. Saye | 2016-06-28 |
| 9241405 | Interposer with extruded feed-through vias | — | 2016-01-19 |
| 8569082 | Semiconductor package with a mold material encapsulating a chip and a portion of a lead frame | Sreenivasan K. Koduri | 2013-10-29 |
| 8304868 | Multi-component electronic system having leadframe with support-free with cantilever leads | Michael G. Amaro, Taylor R. Efland, Sreenivasan K. Koduri | 2012-11-06 |
| 8154109 | Leadframe having delamination resistant die pad | Kapil Heramb Sahasrabudhe | 2012-04-10 |
| 8129228 | Manufacturing method for integrating a shunt resistor into a semiconductor package | Ubol Udompanyavit, Sreenivasan K. Koduri, Gerald W. Steele, Jason Marc Cole | 2012-03-06 |
| 8072770 | Semiconductor package with a mold material encapsulating a chip and a portion of a lead frame | Sreenivasan K. Koduri | 2011-12-06 |
| 8053876 | Multi lead frame power package | Bernhard Lange, Anthony L. Coyle | 2011-11-08 |
| 7919842 | Structure and method for sealing cavity of micro-electro-mechanical device | Christopher Daniel Manack | 2011-04-05 |
| 7847391 | Manufacturing method for integrating a shunt resistor into a semiconductor package | Ubol Udompanyavit, Sreenivasan K. Koduri, Gerald W. Steele, Jason Marc Cole | 2010-12-07 |
| 7821113 | Leadframe having delamination resistant die pad | Kapil Heramb Sahasrabudhe | 2010-10-26 |
| 7741704 | Leadframe and mold compound interlock in packaged semiconductor device | Bernhard Lange | 2010-06-22 |
| 7635613 | Semiconductor device having firmly secured heat spreader | Bernhard Lange | 2009-12-22 |
| 7578422 | Bond capillary design for ribbon wire bonding | Bernhard Lange | 2009-08-25 |
| 7504713 | Plastic semiconductor packages having improved metal land-locking features | Jeffrey Gail Holloway | 2009-03-17 |
| 7488623 | Integrated circuit chip packaging assembly | Anthony L. Coyle, Bernhard Lange | 2009-02-10 |
| 7256482 | Integrated circuit chip packaging assembly | Anthony L. Coyle, Bernhard Lange | 2007-08-14 |
| 7216794 | Bond capillary design for ribbon wire bonding | Bernhard Lange | 2007-05-15 |