PY

Pak Hong Yee

Micron: 5 patents #2,350 of 6,345Top 40%
AP Avago Technologies Ecbu Ip (Singapore) Pte.: 4 patents #97 of 427Top 25%
TI Texas Instruments: 3 patents #4,047 of 12,488Top 35%
Overall (All Time): #423,115 of 4,157,543Top 15%
12
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
8130210 Touch input system using light guides Kuldeep Saxena, Wee Sin Tan, Peng Yam Ng, Rani Saravanan 2012-03-06
7842957 Optical transceiver with reduced height TECK-CHAI GOH, Deng-Peng Chen, Basoor Suresh, Wee Sin Tan, Peng Yam Ng +1 more 2010-11-30
7521794 Intrinsic thermal enhancement for FBGA package Teck Kheng Lee 2009-04-21
7514666 Composite receiver assembly having a circuit board on which multiple receiver devices that operate on different sets of wavelengths are mounted Jing Zhang, Wee Sin Tan 2009-04-07
7495204 Remote control receiver device and ambient light photosensor device incorporated into a single composite assembly Jing Zhang, Wee Sin Tan 2009-02-24
7459346 Intrinsic thermal enhancement for FBGA package Teck Kheng Lee 2008-12-02
7285971 Integrated circuit (IC) test assembly including phase change material for stabilizing temperature during stress testing of integrated circuits and method thereof Wuu Yean Tay 2007-10-23
7138711 Intrinsic thermal enhancement for FBGA package Teck Kheng Lee 2006-11-21
7030640 Integrated circuit (IC) test assembly including phase change material for stabilizing temperature during stress testing of integrated circuits and method thereof Wuu Yean Tay 2006-04-18
6387729 Method for adhering and sealing a silicon chip in an integrated circuit package Kian Teng Eng, Min Yu Chan, Jing Sua Goh, Siu Waf Low, Boon Pew Chan +2 more 2002-05-14
6365833 Integrated circuit package Kian Teng Eng, Min Yu Chan, Jing Sua Goh, Siu Waf Low, Boon Pew Chan +2 more 2002-04-02
6087203 Method for adhering and sealing a silicon chip in an integrated circuit package Kian Teng Eng, Min Yu Chan, Jing Sua Goh, Siu Waf Low, Boon Pew Chan +2 more 2000-07-11