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Intrinsic thermal enhancement for FBGA package |
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2009-04-21 |
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2009-04-07 |
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2009-02-24 |
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Intrinsic thermal enhancement for FBGA package |
Teck Kheng Lee |
2008-12-02 |
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Integrated circuit (IC) test assembly including phase change material for stabilizing temperature during stress testing of integrated circuits and method thereof |
Wuu Yean Tay |
2007-10-23 |
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Intrinsic thermal enhancement for FBGA package |
Teck Kheng Lee |
2006-11-21 |
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Integrated circuit (IC) test assembly including phase change material for stabilizing temperature during stress testing of integrated circuits and method thereof |
Wuu Yean Tay |
2006-04-18 |
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Method for adhering and sealing a silicon chip in an integrated circuit package |
Kian Teng Eng, Min Yu Chan, Jing Sua Goh, Siu Waf Low, Boon Pew Chan +2 more |
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