Issued Patents All Time
Showing 26–50 of 71 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8803307 | Stacked microelectronic devices and methods for manufacturing stacked microelectronic devices | Edmund Koon Tian Lua, See Hiong Leow | 2014-08-12 |
| 8796836 | Land grid array semiconductor device packages | David J. Corisis, Chin Hui Chong | 2014-08-05 |
| 8772947 | Methods for packaging microelectronic devices and microelectronic devices formed using such methods | Chin Hui Chong, David J. Corisis | 2014-07-08 |
| 8754537 | Build-up package for integrated circuit devices, and methods of making same | Hong Wan Ng, David J. Corisis, Chin Hui Chong | 2014-06-17 |
| 8749050 | Redistribution elements and semiconductor device packages including semiconductor devices and redistribution elements | David J. Corisis, Chong Chin Hui | 2014-06-10 |
| 8653625 | Interposer structure with embedded capacitor structure, and methods of making same | Chong Chin Hui, David J. Corisis | 2014-02-18 |
| 8507318 | Method for manufacturing microelectronic devices | Seng Kim Ye, Chin Hui Chong, Wang Lai Lee, Roslan Bin Said | 2013-08-13 |
| 8501546 | Stacked microelectronic devices and methods for manufacturing stacked microelectronic devices | Edmund Koon Tian Lua, See Hiong Leow | 2013-08-06 |
| 8486825 | Methods of forming semiconductor device packages including a semiconductor device and a redistribution element, methods of forming redistribution elements and methods for packaging semiconductor devices | David J. Corisis, Chong Chin Hui | 2013-07-16 |
| 8450839 | Microelectronic devices, stacked microelectronic devices, and methods for manufacturing such devices | David J. Corisis, Chin Hui Chong | 2013-05-28 |
| 8445997 | Stacked packaged integrated circuit devices | David J. Corisis, Chin Hui Chong | 2013-05-21 |
| 8441132 | Packaged microelectronic devices recessed in support member cavities, and associated methods | David J. Corisis, Chin Hui Chong | 2013-05-14 |
| 8426743 | Electronic device assemblies including conductive vias having two or more conductive elements | David J. Corisis, Chin Hui Chong | 2013-04-23 |
| 8357566 | Pre-encapsulated lead frames for microelectronic device packages, and associated methods | Ai Chie Wang, Chin Hui Chong, Wuu Yean Tay | 2013-01-22 |
| 8322031 | Method of manufacturing an interposer | Chin Hui Chong | 2012-12-04 |
| 8288859 | Semiconductor device packages including a semiconductor device and a redistribution element | David J. Corisis, Chong Chin Hui | 2012-10-16 |
| 8202754 | Packaged microelectronic devices recessed in support member cavities, and associated methods | David J. Corisis, Chin Hui Chong | 2012-06-19 |
| 8203213 | Methods for packaging microelectronic devices and microelectronic devices formed using such methods | Chin Hui Chong, David J. Corisis | 2012-06-19 |
| 8148807 | Packaged microelectronic devices and associated systems | Chin Hui Chong, David J. Corisis | 2012-04-03 |
| 8138021 | Apparatus for packaging semiconductor devices, packaged semiconductor components, methods of manufacturing apparatus for packaging semiconductor devices, and methods of manufacturing semiconductor components | David J. Corisis, J. Michael Brooks, Chin Hui Chong | 2012-03-20 |
| 8115112 | Interposer substrates and semiconductor device assemblies and electronic systems including such interposer substrates | David J. Corisis, Chin Hui Chong | 2012-02-14 |
| 8106491 | Methods of forming stacked semiconductor devices with a leadframe and associated assemblies | David J. Corisis, Chin Hui Chong | 2012-01-31 |
| 8093702 | Stacked microelectronic devices and methods for manufacturing stacked microelectronic devices | Edmund Koon Tian Lua, See Hiong Leow | 2012-01-10 |
| 8030751 | Board-on-chip type substrates with conductive traces in multiple planes and semiconductor device packages including such substrates | David J. Corisis, Chin Hui Chong | 2011-10-04 |
| 7915077 | Methods of making metal core foldover package structures | David J. Corisis, Chin Hui Chong | 2011-03-29 |