Issued Patents All Time
Showing 51–71 of 71 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7915726 | Interconnecting substrates for microelectronic dies, methods for forming vias in such substrates, and methods for packaging microelectronic devices | Chin Hui Chong, David J. Corisis | 2011-03-29 |
| 7888185 | Semiconductor device assemblies and systems including at least one conductive pathway extending around a side of at least one semiconductor device | David J. Corisis, Chin Hui Chong | 2011-02-15 |
| 7816778 | Packaged IC device comprising an embedded flex circuit on leadframe, and methods of making same | Chong Chin Hui, David J. Corisis | 2010-10-19 |
| 7759221 | Methods for packaging microelectronic devices and microelectronic devices formed using such methods | Chin Hui Chong, David J. Corisis | 2010-07-20 |
| 7759785 | Apparatus for packaging semiconductor devices, packaged semiconductor components, methods of manufacturing apparatus for packaging semiconductor devices, and methods of manufacturing semiconductor components | David J. Corisis, J. Michael Brooks, Chin Hui Chong | 2010-07-20 |
| 7749808 | Stacked microelectronic devices and methods for manufacturing microelectronic devices | David J. Corisis, Chin Hui Chong | 2010-07-06 |
| 7745920 | Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices | Chin Hui Chong, David J. Corisis | 2010-06-29 |
| 7692931 | Microelectronic packages with leadframes, including leadframes configured for stacked die packages, and associated systems and methods | Chin Hui Chong, David J. Corisis | 2010-04-06 |
| 7671459 | Microelectronic devices, stacked microelectronic devices, and methods for manufacturing such devices | David J. Corisis, Chin Hui Chong | 2010-03-02 |
| 7557443 | Microelectronic devices, stacked microelectronic devices, and methods for manufacturing microelectronic devices | Seng Kim Ye, Chin Hui Chong, Wang Lai Lee, Roslan Bin Said | 2009-07-07 |
| 7485969 | Stacked microelectronic devices and methods for manufacturing microelectronic devices | David J. Corisis, Chin Hui Chong | 2009-02-03 |
| 7465607 | Methods of fabrication of lead frame-based semiconductor device packages incorporating at least one land grid array package | David J. Corisis, Chin Hui Chong | 2008-12-16 |
| 7435913 | Slanted vias for electrical circuits on circuit boards and other substrates | Chin Hui Chong | 2008-10-14 |
| 7425758 | Metal core foldover package structures | David J. Corisis, Chin Hui Chong | 2008-09-16 |
| 7368391 | Methods for designing carrier substrates with raised terminals | Cher Khng Victor Tan, Kian Lee, Guek Har Lim, Wuu Yean Tay, Teck Huat Poh +1 more | 2008-05-06 |
| 7326591 | Interconnecting substrates for microelectronic dies, methods for forming vias in such substrates, and methods for packaging microelectronic devices | Chin Hui Chong, David J. Corisis | 2008-02-05 |
| 7083425 | Slanted vias for electrical circuits on circuit boards and other substrates | Chin Hui Chong | 2006-08-01 |
| 7061124 | Solder masks including dams for at least partially surrounding terminals of a carrier substrate and recessed areas positioned adjacent to the dams, and carrier substrates including such solder masks | Cher Khng Victor Tan, Kian Lee, Guek Har Lim, Wuu Yean Tay, Teck Huat Poh +1 more | 2006-06-13 |
| 7018871 | Solder masks for use on carrier substrates, carrier substrates and semiconductor device assemblies including such solder masks, and methods | Cher Khng Victor Tan, Kian Lee, Guek Har Lim, Wuu Yean Tay, Teck Huat Poh +1 more | 2006-03-28 |
| 6921860 | Microelectronic component assemblies having exposed contacts | Darin L. Peterson, Richard W. Wensel, James A. Faull | 2005-07-26 |
| 6787923 | Solder masks for use on carrier substrates, carrier substrates and semiconductor device assemblies including such solder masks | Cher Khng Victor Tan, Kian Lee, Guek Har Lim, Wuu Yean Tay, Teck Huat Poh +1 more | 2004-09-07 |