Issued Patents All Time
Showing 26–50 of 56 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11527459 | Substrates for semiconductor packages, including hybrid substrates for decoupling capacitors, and associated devices, systems, and methods | Chin Hui Chong, Hem Takiar, Seng Kim Ye, Kelvin Tan Aik Boo | 2022-12-13 |
| 11367667 | Build-up package for integrated circuit devices, and methods of making same | Choon Kuan Lee, David J. Corisis, Chin Hui Chong | 2022-06-21 |
| 11309281 | Overlapping die stacks for NAND package architecture | Enyong Tai, Hem Takiar, Li-Ping Wang | 2022-04-19 |
| 11282811 | Integrated circuit wire bonded to a multi-layer substrate having an open area that exposes wire bond pads at a surface of the inner layer | Kelvin Tan Aik Boo, Chin Hui Chong, Seng Kim Ye, Hem Takiar | 2022-03-22 |
| 11101262 | Stacked semiconductor die assemblies with support members and associated systems and methods | Seng Kim Ye | 2021-08-24 |
| 11101244 | Stacked semiconductor die assemblies with die support members and associated systems and methods | Seng Kim Ye | 2021-08-24 |
| 11094670 | Semiconductor device assemblies including multiple shingled stacks of semiconductor dies | Akshay N. Singh | 2021-08-17 |
| 10811387 | Methods of operating microelectronic devices including a controller | Seng Kim Ye | 2020-10-20 |
| 10727206 | Memory devices with controllers under memory packages and associated systems and methods | Seng Kim Ye | 2020-07-28 |
| 10658336 | Stacked semiconductor die assemblies with die support members and associated systems and methods | Seng Kim Ye | 2020-05-19 |
| 10593607 | Build-up package for integrated circuit devices, and methods of making same | Choon Kuan Lee, David J. Corisis, Chin Hui Chong | 2020-03-17 |
| 10522507 | Semiconductor device assemblies including multiple shingled stacks of semiconductor dies | Akshay N. Singh | 2019-12-31 |
| 10504881 | Stacked semiconductor die assemblies with support members and associated systems and methods | Seng Kim Ye | 2019-12-10 |
| 10312219 | Semiconductor device assemblies including multiple shingled stacks of semiconductor dies | Akshay N. Singh | 2019-06-04 |
| 10304808 | Semiconductor devices including a controller and methods of forming such devices | Seng Kim Ye | 2019-05-28 |
| 10128217 | Memory devices with controllers under memory packages and associated systems and methods | Seng Kim Ye | 2018-11-13 |
| 10014281 | Methods of manufacturing a semiconductor device package including a controller element | Seng Kim Ye | 2018-07-03 |
| 9985000 | Stacked semiconductor die assemblies with die support members and associated systems and methods | Seng Kim Ye | 2018-05-29 |
| 9761562 | Semiconductor device packages including a controller element | Seng Kim Ye | 2017-09-12 |
| 9627367 | Memory devices with controllers under memory packages and associated systems and methods | Seng Kim Ye | 2017-04-18 |
| 9418974 | Stacked semiconductor die assemblies with support members and associated systems and methods | Seng Kim Ye | 2016-08-16 |
| 9406660 | Stacked semiconductor die assemblies with die support members and associated systems and methods | Seng Kim Ye | 2016-08-02 |
| 9355994 | Build-up package for integrated circuit devices, and methods of making same | Choon Kuan Lee, David J. Corisis, Chin Hui Chong | 2016-05-31 |
| 9271403 | Semiconductor assemblies with multi-level substrates and associated methods of manufacturing | Chin Hui Chong | 2016-02-23 |
| 9129862 | Microelectronic devices and microelectronic support devices, and associated assemblies and methods | Teck Kheng Lee, David Yih Ming Chai | 2015-09-08 |