Issued Patents All Time
Showing 51–56 of 56 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8923004 | Microelectronic packages with small footprints and associated methods of manufacturing | Peng Wang Low, Leng Cher Kuah, Seng Kim Ye, Chye Lin Toh | 2014-12-30 |
| 8778732 | Microelectronic devices and microelectronic support devices, and associated assemblies and methods | Teck Kheng Lee, David Yih Ming Chai | 2014-07-15 |
| 8754537 | Build-up package for integrated circuit devices, and methods of making same | Choon Kuan Lee, David J. Corisis, Chin Hui Chong | 2014-06-17 |
| 8637987 | Semiconductor assemblies with multi-level substrates and associated methods of manufacturing | Chin Hui Chong | 2014-01-28 |
| 8174101 | Microelectronic devices and microelectronic support devices, and associated assemblies and methods | Teck Kheng Lee, David Yih Ming Chai | 2012-05-08 |
| 7968369 | Microelectronic devices and microelectronic support devices, and associated assemblies and methods | Teck Kheng Lee, David Yih Ming Chai | 2011-06-28 |