Issued Patents All Time
Showing 51–75 of 312 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8148807 | Packaged microelectronic devices and associated systems | Choon Kuan Lee, Chin Hui Chong | 2012-04-03 |
| 8138021 | Apparatus for packaging semiconductor devices, packaged semiconductor components, methods of manufacturing apparatus for packaging semiconductor devices, and methods of manufacturing semiconductor components | J. Michael Brooks, Choon Kuan Lee, Chin Hui Chong | 2012-03-20 |
| 8125092 | Semiconductor device packages and assemblies | Lee Choon Kuan, Chong Chin Hui | 2012-02-28 |
| 8115112 | Interposer substrates and semiconductor device assemblies and electronic systems including such interposer substrates | Chin Hui Chong, Choon Kuan Lee | 2012-02-14 |
| 8106491 | Methods of forming stacked semiconductor devices with a leadframe and associated assemblies | Chin Hui Chong, Choon Kuan Lee | 2012-01-31 |
| RE43112 | Stackable ball grid array package | Jerry M. Brooks, Walter L. Moden | 2012-01-17 |
| 8072055 | High density stacked die assemblies, structures incorporated therein and methods of fabricating the assemblies | Tongbi Jiang, Shijian Luo | 2011-12-06 |
| 8067827 | Stacked microelectronic device assemblies | — | 2011-11-29 |
| 8049342 | Semiconductor device and method of fabrication thereof | Leonard E. Mess, Jerry M. Brooks | 2011-11-01 |
| 8048715 | Multi-chip module and methods | Jerry M. Brooks, Matt E. Schwab | 2011-11-01 |
| 8035974 | Integrated circuit package support system | Walter L. Moden, Terry R. Lee | 2011-10-11 |
| 8030751 | Board-on-chip type substrates with conductive traces in multiple planes and semiconductor device packages including such substrates | Choon Kuan Lee, Chin Hui Chong | 2011-10-04 |
| 7999378 | Semiconductor devices including semiconductor dice in laterally offset stacked arrangement | Leonard E. Mess, Jerry M. Brooks | 2011-08-16 |
| 7998792 | Semiconductor device assemblies, electronic devices including the same and assembly methods | Leonard E. Mess, Jerry M. Brooks | 2011-08-16 |
| 7955898 | Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices | Matt E. Schwab, J. Michael Brooks | 2011-06-07 |
| 7944057 | Bond pad rerouting element, rerouted semiconductor devices including the rerouting element, and assemblies including the rerouted semiconductor devices | Jerry M. Brooks, Matt E. Schwab, Tracy V. Reynolds | 2011-05-17 |
| 7915726 | Interconnecting substrates for microelectronic dies, methods for forming vias in such substrates, and methods for packaging microelectronic devices | Chin Hui Chong, Choon Kuan Lee | 2011-03-29 |
| 7915077 | Methods of making metal core foldover package structures | Chin Hui Chong, Choon Kuan Lee | 2011-03-29 |
| 7894192 | Integrated circuit package support system | Walter L. Moden, Terry R. Lee | 2011-02-22 |
| 7888185 | Semiconductor device assemblies and systems including at least one conductive pathway extending around a side of at least one semiconductor device | Chin Hui Chong, Choon Kuan Lee | 2011-02-15 |
| 7851922 | Bond pad rerouting element, rerouted semiconductor devices including the rerouting element, and assemblies including the rerouted semiconductor devices | Jerry M. Brooks, Matt E. Schwab, Tracy V. Reynolds | 2010-12-14 |
| 7829991 | Stackable ceramic FBGA for high thermal applications | Walter L. Moden, Leonard E. Mess, Larry D. Kinsman | 2010-11-09 |
| 7816778 | Packaged IC device comprising an embedded flex circuit on leadframe, and methods of making same | Choon Kuan Lee, Chong Chin Hui | 2010-10-19 |
| 7767913 | Electronic devices including conductive vias having two or more conductive elements for providing electrical communication between traces in different planes in a substrate, and accompanying methods | Lee Choon Kuan, Chin Hui Chong | 2010-08-03 |
| 7759221 | Methods for packaging microelectronic devices and microelectronic devices formed using such methods | Choon Kuan Lee, Chin Hui Chong | 2010-07-20 |