Issued Patents All Time
Showing 76–100 of 312 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7759221 | Methods for packaging microelectronic devices and microelectronic devices formed using such methods | Choon Kuan Lee, Chin Hui Chong | 2010-07-20 |
| 7750449 | Packaged semiconductor components having substantially rigid support members and methods of packaging semiconductor components | Matt E. Schwab, J. Michael Brooks | 2010-07-06 |
| 7749808 | Stacked microelectronic devices and methods for manufacturing microelectronic devices | Chin Hui Chong, Choon Kuan Lee | 2010-07-06 |
| 7745920 | Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices | Choon Kuan Lee, Chin Hui Chong | 2010-06-29 |
| 7704794 | Method of forming a semiconductor device | Leonard E. Mess, Jerry M. Brooks | 2010-04-27 |
| 7692931 | Microelectronic packages with leadframes, including leadframes configured for stacked die packages, and associated systems and methods | Chin Hui Chong, Choon Kuan Lee | 2010-04-06 |
| 7691682 | Build-up-package for integrated circuit devices, and methods of making same | Ng Hong Wan, Lee Choon Kuan, Chong Chin Hui | 2010-04-06 |
| 7671459 | Microelectronic devices, stacked microelectronic devices, and methods for manufacturing such devices | Chin Hui Chong, Choon Kuan Lee | 2010-03-02 |
| 7659151 | Flip chip with interposer, and methods of making same | Tongbi Jiang | 2010-02-09 |
| 7619313 | Multi-chip module and methods | Jerry M. Brooks, Matt E. Schwab | 2009-11-17 |
| 7592691 | High density stacked die assemblies, structures incorporated therein and methods of fabricating the assemblies | Tongbi Jiang, Shijian Luo | 2009-09-22 |
| 7572678 | Methods of making and using a floating lead finger on a lead frame | — | 2009-08-11 |
| 7511364 | Floating lead finger on a lead frame, lead frame strip, and lead frame assembly including same | — | 2009-03-31 |
| 7504285 | Carrierless chip package for integrated circuit devices, and methods of making same | Lee Choon Kuan, Chong Chin Hui | 2009-03-17 |
| 7485969 | Stacked microelectronic devices and methods for manufacturing microelectronic devices | Chin Hui Chong, Choon Kuan Lee | 2009-02-03 |
| 7465607 | Methods of fabrication of lead frame-based semiconductor device packages incorporating at least one land grid array package | Chin Hui Chong, Choon Kuan Lee | 2008-12-16 |
| 7459773 | Stackable ball grid array | Todd O. Bolken, Cary J. Baerlocher, Chad A. Cobbley | 2008-12-02 |
| 7425758 | Metal core foldover package structures | Chin Hui Chong, Choon Kuan Lee | 2008-09-16 |
| 7423336 | Bond pad rerouting element, rerouted semiconductor devices including the rerouting element, and assemblies including the rerouted semiconductor devices | Jerry M. Brooks, Matt E. Schwab, Tracy V. Reynolds | 2008-09-09 |
| 7408255 | Assembly for stacked BGA packages | Walter L. Moden, Leonard E. Mess, Larry D. Kinsman | 2008-08-05 |
| 7400032 | Module assembly for stacked BGA packages | Walter L. Moden, Leonard E. Mess, Larry D. Kinsman | 2008-07-15 |
| 7396702 | Module assembly and method for stacked BGA packages | Walter L. Moden, Leonard E. Mess, Larry D. Kinsman | 2008-07-08 |
| 7378723 | Method and apparatus for decoupling conductive portions of a microelectronic device package | Aaron Schoenfeld | 2008-05-27 |
| 7375419 | Stacked mass storage flash memory package | Leonard E. Mess, Jerry M. Brooks | 2008-05-20 |
| 7372138 | Routing element for use in multi-chip modules, multi-chip modules including the routing element and methods | Jerry M. Brooks, Matt E. Schwab, Tracy V. Reynolds | 2008-05-13 |