Issued Patents All Time
Showing 101–125 of 312 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7372131 | Routing element for use in semiconductor device assemblies | Jerry M. Brooks, Matt E. Schwab, Tracy V. Reynolds | 2008-05-13 |
| 7367845 | Modular sockets using flexible interconnects | Warren M. Farnworth, Salman Akram | 2008-05-06 |
| 7365420 | Semiconductor packages and methods for making and using same | — | 2008-04-29 |
| 7326591 | Interconnecting substrates for microelectronic dies, methods for forming vias in such substrates, and methods for packaging microelectronic devices | Chin Hui Chong, Choon Kuan Lee | 2008-02-05 |
| 7321160 | Multi-part lead frame | S. Hinkle, Jerry M. Brooks | 2008-01-22 |
| 7312516 | Chip scale package with heat spreader | — | 2007-12-25 |
| 7291900 | Lead frame-based semiconductor device packages incorporating at least one land grid array package | Chin Hui Chong, Choon Kuan Le | 2007-11-06 |
| 7285442 | Stackable ceramic FBGA for high thermal applications | Walter L. Moden, Leonard E. Mess, Larry D. Kinsman | 2007-10-23 |
| 7282397 | Methods for designing bond pad rerouting elements for use in stacked semiconductor device assemblies and for assembling semiconductor devices | Jerry M. Brooks, Matt E. Schwab, Tracy V. Reynolds | 2007-10-16 |
| 7282805 | Bond pad rerouting element and stacked semiconductor device assemblies including the rerouting element | Jerry M. Brooks, Matt E. Schwab, Tracy V. Reynolds | 2007-10-16 |
| 7279797 | Module assembly and method for stacked BGA packages | Walter L. Moden, Leonard E. Mess, Larry D. Kinsman | 2007-10-09 |
| 7262506 | Stacked mass storage flash memory package | Leonard E. Mess, Jerry M. Brooks | 2007-08-28 |
| 7257884 | Method for fabricating semiconductor component with adjustment circuitry for electrical characteristics or input/output configuration | Aaron Schoenfeld, Tyler Gomm | 2007-08-21 |
| 7239029 | Packages for semiconductor die | Todd O. Bolken, Cary J. Baerlocher, Chad A. Cobbley | 2007-07-03 |
| 7235871 | Stacked microelectronic dies | — | 2007-06-26 |
| 7233056 | Chip scale package with heat spreader | — | 2007-06-19 |
| 7226813 | Semiconductor package | — | 2007-06-05 |
| 7192311 | Apparatus for forming modular sockets using flexible interconnects and resulting structures | Warren M. Farnworth, Salman Akram | 2007-03-20 |
| 7183138 | Method and apparatus for decoupling conductive portions of a microelectronic device package | Aaron Schoenfeld | 2007-02-27 |
| 7153164 | Method and apparatus for forming modular sockets using flexible interconnects and resulting structures | Warren M. Farnworth, Salman Akram | 2006-12-26 |
| 7151013 | Semiconductor package having exposed heat dissipating surface and method of fabrication | Mike Brooks, Mark S. Johnson, Larry D. Kinsman | 2006-12-19 |
| 7144245 | Packages for semiconductor die | Todd O. Bolken, Cary J. Baerlocher, Chad A. Cobbley | 2006-12-05 |
| 7101730 | Method of manufacturing a stackable ball grid array | Todd O. Bolken, Cary J. Baerlocher, Chad A. Cobbley | 2006-09-05 |
| 7098527 | Integrated circuit package electrical enhancement with improved lead frame design | Jerry M. Brooks | 2006-08-29 |
| 7094108 | Apparatus for forming modular sockets using flexible interconnects and resulting structures | Warren M. Farnworth, Salman Akram | 2006-08-22 |