Issued Patents All Time
Showing 151–175 of 312 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6900528 | Stacked mass storage flash memory package | Leonard E. Mess, Jerry M. Brooks | 2005-05-31 |
| 6894372 | Tape under frame for lead frame IC package assembly | Larry D. Kinsman, Jerry M. Brooks | 2005-05-17 |
| 6882034 | Routing element for use in multi-chip modules, multi-chip modules including the routing element, and methods | Jerry M. Brooks, Matt E. Schwab, Tracy V. Reynolds | 2005-04-19 |
| 6879050 | Packaged microelectronic devices and methods for packaging microelectronic devices | Blaine J. Thurgood | 2005-04-12 |
| 6867500 | Multi-chip module and methods | Jerry M. Brooks, Matt E. Schwab | 2005-03-15 |
| 6858926 | Stackable ceramic FBGA for high thermal applications | Walter L. Moden, Leonard E. Mess, Larry D. Kinsman | 2005-02-22 |
| 6858453 | Integrated circuit package alignment feature | Tracy V. Reynolds, Michael Slaughter, Daniel P. Cram, Leland R. Nevill | 2005-02-22 |
| 6856013 | Integrated circuit packages, ball-grid array integrated circuit packages and methods of packaging an integrated circuit | — | 2005-02-15 |
| 6847100 | High speed IC package configuration | Brent Keeth | 2005-01-25 |
| 6838768 | Module assembly for stacked BGA packages | Walter L. Moden, Leonard E. Mess, Larry D. Kinsman | 2005-01-04 |
| 6837731 | Locking assembly for securing a semiconductor device to a carrier substrate | Jerry M. Brooks, Terry R. Lee | 2005-01-04 |
| 6836003 | Integrated circuit package alignment feature | Tracy V. Reynolds, Michael Slaughter, Daniel P. Cram, Leland R. Nevill, Jerrold L. King | 2004-12-28 |
| 6835604 | Methods for transverse hybrid LOC package | — | 2004-12-28 |
| 6830961 | Methods for leads under chip in conventional IC package | — | 2004-12-14 |
| 6815807 | Method of fabricating a redundant pinout configuration for signal enhancement in an IC package | — | 2004-11-09 |
| 6778404 | Stackable ball grid array | Todd O. Bolken, Cary J. Baerlocher, Chad A. Cobbley | 2004-08-17 |
| 6777790 | Redundant pinout configuration for signal enhancement in IC packages | — | 2004-08-17 |
| 6772510 | Mapable tape apply for LOC and BOC packages | — | 2004-08-10 |
| 6765291 | IC package with dual heat spreaders | — | 2004-07-20 |
| 6760970 | Method for forming modular sockets using flexible interconnects and resulting structures | Warren M. Farnworth, Salman Akram | 2004-07-13 |
| 6758696 | Method and apparatus for forming modular sockets using flexible interconnects and resulting structures | Warren M. Farnworth, Salman Akram | 2004-07-06 |
| 6760224 | Heat sink with alignment and retaining features | Walter L. Moden, Larry D. Kinsman, Leonard E. Mess | 2004-07-06 |
| 6756659 | Die paddle clamping method for wire bond enhancement | — | 2004-06-29 |
| 6753598 | Transverse hybrid LOC package | — | 2004-06-22 |
| 6753482 | Semiconductor component with adjustment circuitry | Aaron Schoenfeld, Tyler Gomm | 2004-06-22 |