Issued Patents All Time
Showing 176–200 of 312 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6751859 | Method for forming modular sockets using flexible interconnects and resulting structures | Warren M. Farnworth, Salman Akram | 2004-06-22 |
| 6747344 | Lead frame assemblies with voltage reference plane and IC packages including same | Jerry M. Brooks, Terry R. Lee | 2004-06-08 |
| 6743658 | Methods of packaging an integrated circuit | — | 2004-06-01 |
| 6740546 | Packaged microelectronic devices and methods for assembling microelectronic devices | Mike Brooks | 2004-05-25 |
| 6738263 | Stackable ball grid array package | Jerry M. Brooks, Walter L. Moden | 2004-05-18 |
| 6717257 | Lead frame decoupling capacitor, semiconductor device packages including the same and methods | Chris G. Martin | 2004-04-06 |
| 6670702 | Stackable ball grid array package | Jerry M. Brooks, Walter L. Moden | 2003-12-30 |
| 6650007 | Stackable ceramic fbga for high thermal applications | Walter L. Moden, Leonard E. Mess, Larry D. Kinsman | 2003-11-18 |
| 6648663 | Locking assembly for securing semiconductor device to carrier substrate | Jerry M. Brooks, Terry R. Lee | 2003-11-18 |
| 6630732 | Lead frames including inner-digitized bond fingers on bus bars and semiconductor device package including same | — | 2003-10-07 |
| 6630733 | Integrated circuit package electrical enhancement | Jerry M. Brooks | 2003-10-07 |
| 6612872 | Apparatus for forming modular sockets using flexible interconnects and resulting structures | Warren M. Farnworth, Salman Akram | 2003-09-02 |
| 6607937 | Stacked microelectronic dies and methods for stacking microelectronic dies | — | 2003-08-19 |
| 6590277 | Reduced stress LOC assembly | Jerrold L. King, Larry D. Kinsman, Jerry M. Brooks | 2003-07-08 |
| 6580158 | High speed IC package configuration | Brent Keeth | 2003-06-17 |
| 6576988 | Semiconductor package | — | 2003-06-10 |
| 6570244 | Multi-part lead frame with dissimilar materials | S. Hinkle, Jerry M. Brooks | 2003-05-27 |
| 6565374 | Locking assembly for securing semiconductor device to carrier substrate | Jerry M. Brooks, Terry R. Lee | 2003-05-20 |
| 6563192 | Semiconductor die with integral decoupling capacitor | Jerry M. Brooks | 2003-05-13 |
| 6563217 | Module assembly for stacked BGA packages | Walter L. Moden, Leonard E. Mess, Larry D. Kinsman | 2003-05-13 |
| 6558966 | Apparatus and methods of packaging and testing die | Leonard E. Mess, Walter L. Moden, Larry D. Kinsman | 2003-05-06 |
| 6552420 | Redundant pinout configuration for signal enhancement in IC packages | — | 2003-04-22 |
| 6549421 | Stackable ball grid array package | Jerry M. Brooks, Walter L. Moden | 2003-04-15 |
| 6541856 | Thermally enhanced high density semiconductor package | Mike Brooks, Mark S. Johnson, Larry D. Kinsman | 2003-04-01 |
| 6537850 | Method for fabricating semiconductor components with terminal contacts having alternate electrical paths | — | 2003-03-25 |