Issued Patents All Time
Showing 226–250 of 312 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6414391 | Module assembly for stacked BGA packages with a common bus bar in the assembly | Walter L. Moden, Leonard E. Mess, Larry D. Kinsman | 2002-07-02 |
| 6406943 | Transverse hybrid LOC package | — | 2002-06-18 |
| 6398573 | Locking assembly for securing semiconductor device to carrier substrate | Jerry M. Brooks, Terry R. Lee | 2002-06-04 |
| 6395579 | Controlling packaging encapsulant leakage | Patrick W. Tandy, Joseph Brand, Brad D. Rumsey, Steven R. Stephenson, Todd O. Bolken +2 more | 2002-05-28 |
| 6391681 | Semiconductor component having selected terminal contacts with multiple electrical paths | — | 2002-05-21 |
| 6392291 | Semiconductor component having selected terminal contacts with multiple electrical paths | — | 2002-05-21 |
| 6381141 | Integrated device and method for routing a signal through the device | Fonda R. Victory | 2002-04-30 |
| 6380631 | Apparatus and methods of packaging and testing die | Leonard E. Mess, Walter L. Moden, Larry D. Kinsman | 2002-04-30 |
| 6376277 | Semiconductor package | — | 2002-04-23 |
| 6376282 | Inner-digitized bond fingers on bus bars of semiconductor device package | — | 2002-04-23 |
| 6368136 | Locking assembly for securing semiconductor device to carrier substrate | Jerry M. Brooks, Terry R. Lee | 2002-04-09 |
| 6362022 | Multi-part lead frame with dissimilar materials and method of manufacturing | S. Hinkle, Jerry M. Brooks | 2002-03-26 |
| 6362426 | Radiused leadframe | Ronnie M. Harrison | 2002-03-26 |
| 6339253 | Semiconductor package | — | 2002-01-15 |
| 6331939 | Stackable ball grid array package | Jerry M. Brooks, Walter L. Moden | 2001-12-18 |
| 6329710 | Integrated circuit package electrical enhancement | Jerry M. Brooks | 2001-12-11 |
| 6329220 | Packages for semiconductor die | Todd O. Bolken, Cary J. Baerlocher, Chad A. Cobbley | 2001-12-11 |
| 6329222 | Interconnect for packaging semiconductor dice and fabricating BGA packages | Walter L. Moden | 2001-12-11 |
| 6326238 | Die paddle clamping method for wire bond enhancement | — | 2001-12-04 |
| 6326687 | IC package with dual heat spreaders | — | 2001-12-04 |
| 6319065 | Method and apparatus for forming modular sockets using flexible interconnects and resulting structures | Warren M. Farnworth, Salman Akram | 2001-11-20 |
| 6316717 | Heat sink for microchip application | Walter L. Moden | 2001-11-13 |
| 6314639 | Chip scale package with heat spreader and method of manufacture | — | 2001-11-13 |
| 6306687 | Tape under frame for conventional-type IC package assembly | Larry D. Kinsman, Jerry M. Brooks | 2001-10-23 |
| 6302719 | Locking assembly for securing semiconductor device to carrier substrate | Jerry M. Brooks, Terry R. Lee | 2001-10-16 |