Issued Patents All Time
Showing 201–225 of 312 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6531342 | Method for transverse hybrid loc package | — | 2003-03-11 |
| 6531763 | Interposers having encapsulant fill control features | Todd O. Bolken | 2003-03-11 |
| 6525943 | Heat sink with alignment and retaining features | Walter L. Moden, Larry D. Kinsman, Leonard E. Mess | 2003-02-25 |
| 6521980 | Controlling packaging encapsulant leakage | Patrick W. Tandy, Joseph Brand, Brad D. Rumsey, Steven R. Stephenson, Todd O. Bolken +2 more | 2003-02-18 |
| 6518098 | IC package with dual heat spreaders | — | 2003-02-11 |
| 6518650 | Tape under frame for lead frame IC package assembly | Larry D. Kinsman, Jerry M. Brooks | 2003-02-11 |
| 6518654 | Packages for semiconductor die | Todd O. Bolken, Cary J. Baerlocher, Chad A. Cobbley | 2003-02-11 |
| 6515359 | Lead frame decoupling capacitor semiconductor device packages including the same and methods | Chris G. Martin | 2003-02-04 |
| 6512302 | Apparatus and methods of packaging and testing die | Leonard E. Mess, Walter L. Moden, Larry D. Kinsman | 2003-01-28 |
| 6509632 | Method of fabricating a redundant pinout configuration for signal enhancement in an IC package | — | 2003-01-21 |
| 6507094 | Die paddle clamping for wire bond enhancement | — | 2003-01-14 |
| 6505400 | Method of making chip scale package with heat spreader | — | 2003-01-14 |
| 6478627 | Method and apparatus for forming modular sockets using flexible interconnects and resulting structures | Warren M. Farnworth, Salman Akram | 2002-11-12 |
| 6479326 | Heat sink for microchip application | Walter L. Moden | 2002-11-12 |
| 6476468 | Transverse hybrid LOC package | — | 2002-11-05 |
| 6472737 | Lead frame decoupling capacitor, semiconductor device packages including the same and methods | Chris G. Martin | 2002-10-29 |
| 6462273 | Semiconductor card and method of fabrication | Todd O. Bolken | 2002-10-08 |
| 6457985 | Locking assembly for securing semiconductor device to carrier substrate | Jerry M. Brooks, Terry R. Lee | 2002-10-01 |
| 6455928 | Stackable ball grid array package | Jerry M. Brooks, Walter L. Moden | 2002-09-24 |
| 6453550 | Method for forming modular sockets using flexible interconnects and resulting structures | Warren M. Farnworth, Salman Akram | 2002-09-24 |
| 6448640 | Ball array layout in chip assembly | — | 2002-09-10 |
| 6445061 | Leads under chip in conventional IC package | — | 2002-09-03 |
| 6445067 | Integrated circuit package electrical enhancement | Jerry M. Brooks | 2002-09-03 |
| 6423624 | Ball array layout | — | 2002-07-23 |
| 6414378 | High speed IC package configuration | Brent Keeth | 2002-07-02 |