Issued Patents All Time
Showing 251–275 of 312 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6303984 | Lead frame including angle iron tie bar | — | 2001-10-16 |
| 6297548 | Stackable ceramic FBGA for high thermal applications | Walter L. Moden, Leonard E. Mess, Larry D. Kinsman | 2001-10-02 |
| 6297960 | Heat sink with alignment and retaining features | Walter L. Moden, Larry D. Kinsman, Leonard E. Mess | 2001-10-02 |
| 6294839 | Apparatus and methods of packaging and testing die | Leonard E. Mess, Walter L. Moden, Larry D. Kinsman | 2001-09-25 |
| 6288441 | Die paddle clamping method for wire bond enhancement | — | 2001-09-11 |
| 6285070 | Method of forming semiconductor die with integral decoupling capacitor | Jerry M. Brooks | 2001-09-04 |
| 6284571 | Lead frame assemblies with voltage reference plane and IC packages including same | Jerry M. Brooks, Terry R. Lee | 2001-09-04 |
| 6277673 | Leads under chip in conventional IC package | — | 2001-08-21 |
| 6271580 | Leads under chip in conventional IC package | — | 2001-08-07 |
| 6268649 | Stackable ball grid array package | Jerry M. Brooks, Walter L. Moden | 2001-07-31 |
| 6259153 | Transverse hybrid LOC package | — | 2001-07-10 |
| 6258624 | Semiconductor package having downset leadframe for reducing package bow | — | 2001-07-10 |
| 6249047 | Ball array layout | — | 2001-06-19 |
| 6246108 | Integrated circuit package including lead frame with electrically isolated alignment feature | Tracy V. Reynolds, Michael Slaughter, Daniel P. Cram, Leland R. Nevill, Jerrold L. King | 2001-06-12 |
| 6238228 | Locking assembly for securing semiconductor device to carrier substrate | Jerry M. Brooks, Terry R. Lee | 2001-05-29 |
| 6232666 | Interconnect for packaging semiconductor dice and fabricating BGA packages | Walter L. Moden | 2001-05-15 |
| 6229202 | Semiconductor package having downset leadframe for reducing package bow | — | 2001-05-08 |
| 6218216 | Transverse hybrid LOC package | — | 2001-04-17 |
| 6215177 | Tape under frame for conventional-type IC package assembly | Larry D. Kinsman, Jerry M. Brooks | 2001-04-10 |
| 6210992 | Controlling packaging encapsulant leakage | Patrick W. Tandy, Joseph Brand, Brad D. Rumsey, Steven R. Stephenson, Todd O. Bolken +2 more | 2001-04-03 |
| 6198162 | Method and apparatus for a chip-on-board semiconductor module | — | 2001-03-06 |
| 6184465 | Semiconductor package | — | 2001-02-06 |
| 6163956 | Method of making chip scale package with heat spreade | — | 2000-12-26 |
| 6162662 | Die paddle clamping method for wire bond enhancement | — | 2000-12-19 |
| 6150710 | Transverse hybrid LOC package | — | 2000-11-21 |