Issued Patents All Time
Showing 276–300 of 312 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6144089 | Inner-digitized bond fingers on bus bars of semiconductor device package | — | 2000-11-07 |
| 6143589 | Tape under frame for conventional-type IC package assembly | Larry D. Kinsman, Jerry M. Brooks | 2000-11-07 |
| 6140154 | Multi-part lead frame with dissimilar materials and method of manufacturing | S. Hinkle, Jerry M. Brooks | 2000-10-31 |
| 6133622 | High speed IC package configuration | Brent Keeth | 2000-10-17 |
| 6130474 | Leads under chip IC package | — | 2000-10-10 |
| 6124150 | Transverse hybrid LOC package | — | 2000-09-26 |
| 6121674 | Die paddle clamping method for wire bond enhancement | — | 2000-09-19 |
| 6111307 | Method of making lead frame including angle iron tie bar | — | 2000-08-29 |
| 6103547 | High speed IC package configuration | Brent Keeth | 2000-08-15 |
| 6095822 | Component module holder | Larry D. Kinsman, Walter L. Moden | 2000-08-01 |
| 6091133 | Assembly of a semiconductor device and paddleless lead frame having tape extending between the lead fingers | Larry D. Kinsman, Jerry M. Brooks | 2000-07-18 |
| 6089920 | Modular die sockets with flexible interconnects for packaging bare semiconductor die | Warren M. Farnworth, Salman Akram | 2000-07-18 |
| 6087720 | Integrated circuit package electrical enhancement | Jerry M. Brooks | 2000-07-11 |
| 6083777 | Reduced stress LOC assembly | Jerrold L. King, Larry D. Kinsman, Jerry M. Brooks | 2000-07-04 |
| 6072233 | Stackable ball grid array package | Jerry M. Brooks, Walter L. Moden | 2000-06-06 |
| 6072228 | Multi-part lead frame with dissimilar materials and method of manufacturing | S. Hinkle, Jerry M. Brooks | 2000-06-06 |
| 6071139 | Locking assembly for securing semiconductor device to carrier substrate | Jerry M. Brooks, Terry R. Lee | 2000-06-06 |
| 6063650 | Reduced stress LOC assembly | Jerrold L. King, Larry D. Kinsman, Jerry M. Brooks | 2000-05-16 |
| 6061242 | Die paddle heat sink with thermal posts | Walter L. Moden | 2000-05-09 |
| 6048744 | Integrated circuit package alignment feature | Tracy V. Reynolds, Michael Slaughter, Daniel P. Cram, Leland R. Nevill, Jerrold L. King | 2000-04-11 |
| 6046496 | Chip package | Walter L. Moden | 2000-04-04 |
| 6031733 | Preventing movement of integrated circuit packages relative to their support surface | Walter L. Moden, Terry R. Lee | 2000-02-29 |
| 6008073 | Method of manufacturing a bus bar structure on lead frame of semiconductor device package | Jerrold L. King | 1999-12-28 |
| 5982654 | System for connecting semiconductor devices | — | 1999-11-09 |
| 5982027 | Integrated circuit interposer with power and ground planes | — | 1999-11-09 |