Issued Patents All Time
Showing 301–312 of 312 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5955777 | Lead frame assemblies with voltage reference plane and IC packages including same | Jerry M. Brooks, Terry R. Lee | 1999-09-21 |
| 5956236 | Integrated circuit package support system | Walter L. Moden, Terry R. Lee | 1999-09-21 |
| 5944199 | Integrated circuit package support system | Walter L. Moden, Terry R. Lee | 1999-08-31 |
| 5915166 | Tape under frame for conventional-type IC package assembly | Larry D. Kinsman, Jerry M. Brooks | 1999-06-22 |
| 5914529 | Bus bar structure on lead frame of semiconductor device package | Jerrold L. King | 1999-06-22 |
| 5907184 | Integrated circuit package electrical enhancement | Jerry M. Brooks | 1999-05-25 |
| 5907769 | Leads under chip in conventional IC package | — | 1999-05-25 |
| 5889318 | Lead frame including angle iron tie bar and method of making the same | — | 1999-03-30 |
| 5872398 | Reduced stress LOC assembly including cantilevered leads | Jerrold L. King, Larry D. Kinsman, Jerry M. Brooks | 1999-02-16 |
| 5818698 | Method and apparatus for a chip-on-board semiconductor module | — | 1998-10-06 |
| 5763945 | Integrated circuit package electrical enhancement with improved lead frame design | Jerry M. Brooks | 1998-06-09 |
| 5729049 | Tape under frame for conventional-type IC package assembly | Larry D. Kinsman, Jerry M. Brooks | 1998-03-17 |