Issued Patents All Time
Showing 126–150 of 312 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7094631 | Methods for designing bond pad rerouting elements for use in stacked semiconductor device assemblies and for assembling semiconductor devices | Jerry M. Brooks, Matt E. Schwab, Tracy V. Reynolds | 2006-08-22 |
| 7091060 | Circuit and substrate encapsulation methods | Todd O. Bolken, Cary J. Baerlocher, Chad A. Cobbley | 2006-08-15 |
| 7084490 | Leads under chip IC package | — | 2006-08-01 |
| 7082678 | Method of fabricating an integrated circuit package | Ronnie M. Harrison | 2006-08-01 |
| 7084514 | Multi-chip module and methods | Jerry M. Brooks, Matt E. Schwab | 2006-08-01 |
| 7071542 | Lead frame decoupling capacitor, semiconductor device packages including the same and methods | Chris G. Martin | 2006-07-04 |
| 7056771 | Method of forming an array of semiconductor packages | — | 2006-06-06 |
| 7055241 | Method of fabricating an integrated circuit package | Ronnie M. Harrison | 2006-06-06 |
| 7040930 | Modular sockets using flexible interconnects | Warren M. Farnworth, Salman Akram | 2006-05-09 |
| 7019408 | Stackable ball grid array | Todd O. Bolken, Cary J. Baerlocher, Chad A. Cobbley | 2006-03-28 |
| 7007375 | Method for fabricating a semiconductor component | Aaron Schoenfeld, Tyler Gomm | 2006-03-07 |
| 6995043 | Methods for fabricating routing elements for multichip modules | Jerry M. Brooks, Matt E. Schwab, Tracy V. Reynolds | 2006-02-07 |
| 6987325 | Bond pad rerouting element and stacked semiconductor device assemblies including the rerouting element | Jerry M. Brooks, Matt E. Schwab, Tracy V. Reynolds | 2006-01-17 |
| 6979596 | Method of fabricating a tape having apertures under a lead frame for conventional IC packages | Larry D. Kinsman, Jerry M. Brooks | 2005-12-27 |
| 6977214 | Die paddle clamping method for wire bond enhancement | — | 2005-12-20 |
| 6958528 | Leads under chip IC package | — | 2005-10-25 |
| 6949821 | Semiconductor package | — | 2005-09-27 |
| 6946722 | Multi-part lead frame with dissimilar materials | S. Hinkle, Jerry M. Brooks | 2005-09-20 |
| 6939739 | Integrated circuit packages, ball-grid array integrated circuit packages and methods of packaging an integrated circuit | — | 2005-09-06 |
| 6924550 | Packaged microelectronic devices and methods for assembling microelectronic devices | Mike Brooks | 2005-08-02 |
| 6920688 | Method for a semiconductor assembly having a semiconductor die with dual heat spreaders | — | 2005-07-26 |
| 6921966 | Tape under frame for lead frame IC package assembly | Larry D. Kinsman, Jerry M. Brooks | 2005-07-26 |
| 6914275 | Semiconductor component with electrical characteristic adjustment circuitry | Aaron Schoenfeld, Tyler Gomm | 2005-07-05 |
| 6903464 | Semiconductor die package | — | 2005-06-07 |
| 6902952 | Multi-part lead frame with dissimilar materials and method of manufacturing | S. Hinkle, Jerry M. Brooks | 2005-06-07 |