Issued Patents All Time
Showing 26–50 of 312 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9084360 | Electronic device assemblies including conductive vias having two or more conductive elements | Choon Kuan Lee, Chin Hui Chong | 2015-07-14 |
| 8975745 | Packaged microelectronic devices recessed in support member cavities, and associated methods | Chin Hui Chong, Choon Kuan Lee | 2015-03-10 |
| 8959759 | Method for assembling computer modules small in thickness | Kevin Gibbons, Tracy V. Reynolds | 2015-02-24 |
| 8963302 | Stacked packaged integrated circuit devices, and methods of making same | Chin Hui Chong, Choon Kuan Lee | 2015-02-24 |
| 8940581 | Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices | Choon Kuan Lee, Chin Hui Chong | 2015-01-27 |
| 8869387 | Methods for making microelectronic die systems | Chin Hui Chong, Choon Kuan Lee | 2014-10-28 |
| 8866272 | Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices | Matt E. Schwab, J. Michael Brooks | 2014-10-21 |
| 8796836 | Land grid array semiconductor device packages | Choon Kuan Lee, Chin Hui Chong | 2014-08-05 |
| 8772947 | Methods for packaging microelectronic devices and microelectronic devices formed using such methods | Choon Kuan Lee, Chin Hui Chong | 2014-07-08 |
| 8754537 | Build-up package for integrated circuit devices, and methods of making same | Hong Wan Ng, Choon Kuan Lee, Chin Hui Chong | 2014-06-17 |
| 8749050 | Redistribution elements and semiconductor device packages including semiconductor devices and redistribution elements | Choon Kuan Lee, Chong Chin Hui | 2014-06-10 |
| 8735183 | System in package (SIP) with dual laminate interposers | Matt E. Schwab | 2014-05-27 |
| 8653625 | Interposer structure with embedded capacitor structure, and methods of making same | Chong Chin Hui, Choon Kuan Lee | 2014-02-18 |
| 8644030 | Computer modules with small thicknesses and associated methods of manufacturing | Kevin Gibbons, Tracy V. Reynolds | 2014-02-04 |
| 8587109 | Stacked microelectronic dies and methods for stacking microelectronic dies | — | 2013-11-19 |
| 8486825 | Methods of forming semiconductor device packages including a semiconductor device and a redistribution element, methods of forming redistribution elements and methods for packaging semiconductor devices | Choon Kuan Lee, Chong Chin Hui | 2013-07-16 |
| 8450839 | Microelectronic devices, stacked microelectronic devices, and methods for manufacturing such devices | Chin Hui Chong, Choon Kuan Lee | 2013-05-28 |
| 8445997 | Stacked packaged integrated circuit devices | Chin Hui Chong, Choon Kuan Lee | 2013-05-21 |
| 8441132 | Packaged microelectronic devices recessed in support member cavities, and associated methods | Chin Hui Chong, Choon Kuan Lee | 2013-05-14 |
| 8426743 | Electronic device assemblies including conductive vias having two or more conductive elements | Choon Kuan Lee, Chin Hui Chong | 2013-04-23 |
| 8288859 | Semiconductor device packages including a semiconductor device and a redistribution element | Choon Kuan Lee, Chong Chin Hui | 2012-10-16 |
| 8217505 | Packaged IC device comprising an embedded flex circuit on leadframe, and methods of making same | Choo Kuan Lee, Chin Hui Chong | 2012-07-10 |
| 8202754 | Packaged microelectronic devices recessed in support member cavities, and associated methods | Chin Hui Chong, Choon Kuan Lee | 2012-06-19 |
| 8203213 | Methods for packaging microelectronic devices and microelectronic devices formed using such methods | Choon Kuan Lee, Chin Hui Chong | 2012-06-19 |
| 8178984 | Flip chip with interposer | Tongbi Jiang | 2012-05-15 |