Issued Patents All Time
Showing 26–50 of 170 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7112252 | Assembly method for semiconductor die and lead frame | Larry D. Kinsman, Timothy J. Allen | 2006-09-26 |
| 7098527 | Integrated circuit package electrical enhancement with improved lead frame design | David J. Corisis | 2006-08-29 |
| 7094631 | Methods for designing bond pad rerouting elements for use in stacked semiconductor device assemblies and for assembling semiconductor devices | David J. Corisis, Matt E. Schwab, Tracy V. Reynolds | 2006-08-22 |
| 7091061 | Method of forming a stack of packaged memory dice | Jerrold L. King | 2006-08-15 |
| 7084514 | Multi-chip module and methods | David J. Corisis, Matt E. Schwab | 2006-08-01 |
| 7061092 | High-density modularity for ICS | Salman Akram | 2006-06-13 |
| 7038315 | Semiconductor chip package | Jerrold L. King | 2006-05-02 |
| 6995043 | Methods for fabricating routing elements for multichip modules | David J. Corisis, Matt E. Schwab, Tracy V. Reynolds | 2006-02-07 |
| 6987325 | Bond pad rerouting element and stacked semiconductor device assemblies including the rerouting element | David J. Corisis, Matt E. Schwab, Tracy V. Reynolds | 2006-01-17 |
| 6982486 | Cavity ball grid array apparatus having improved inductance characteristics and method of fabricating the same | Steven G. Thummel | 2006-01-03 |
| 6979596 | Method of fabricating a tape having apertures under a lead frame for conventional IC packages | David J. Corisis, Larry D. Kinsman | 2005-12-27 |
| 6979895 | Semiconductor assembly of stacked substrates and multiple semiconductor dice | Salman Akram | 2005-12-27 |
| 6979904 | Integrated circuit package having reduced interconnects | Warren M. Farnworth | 2005-12-27 |
| 6965160 | Semiconductor dice packages employing at least one redistribution layer | Chad A. Cobbley | 2005-11-15 |
| 6946722 | Multi-part lead frame with dissimilar materials | S. Hinkle, David J. Corisis | 2005-09-20 |
| 6921966 | Tape under frame for lead frame IC package assembly | David J. Corisis, Larry D. Kinsman | 2005-07-26 |
| 6906409 | Multichip semiconductor package | Jerrold L. King | 2005-06-14 |
| 6902952 | Multi-part lead frame with dissimilar materials and method of manufacturing | S. Hinkle, David J. Corisis | 2005-06-07 |
| 6900549 | Semiconductor assembly without adhesive fillets | — | 2005-05-31 |
| 6900528 | Stacked mass storage flash memory package | Leonard E. Mess, David J. Corisis | 2005-05-31 |
| 6897553 | Apparatus for forming a stack of packaged memory dice | Jerrold L. King | 2005-05-24 |
| 6897096 | Method of packaging semiconductor dice employing at least one redistribution layer | Chad A. Cobbley | 2005-05-24 |
| 6894372 | Tape under frame for lead frame IC package assembly | David J. Corisis, Larry D. Kinsman | 2005-05-17 |
| 6884654 | Method of forming a stack of packaged memory dice | Jerrold L. King | 2005-04-26 |
| 6882034 | Routing element for use in multi-chip modules, multi-chip modules including the routing element, and methods | David J. Corisis, Matt E. Schwab, Tracy V. Reynolds | 2005-04-19 |