Issued Patents All Time
Showing 76–100 of 170 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6570244 | Multi-part lead frame with dissimilar materials | S. Hinkle, David J. Corisis | 2003-05-27 |
| 6565374 | Locking assembly for securing semiconductor device to carrier substrate | David J. Corisis, Terry R. Lee | 2003-05-20 |
| 6563192 | Semiconductor die with integral decoupling capacitor | David J. Corisis | 2003-05-13 |
| 6549421 | Stackable ball grid array package | David J. Corisis, Walter L. Moden | 2003-04-15 |
| 6545343 | Hybrid frame with lead-lock tape | Larry D. Kinsman, Timothy J. Allen | 2003-04-08 |
| 6531339 | Redundancy mapping in a multichip semiconductor package | Jerrold L. King | 2003-03-11 |
| 6531338 | Method of manufacturing a semiconductor structure having stacked semiconductor devices | Salman Akram | 2003-03-11 |
| 6531337 | Method of manufacturing a semiconductor structure having stacked semiconductor devices | Salman Akram | 2003-03-11 |
| 6518650 | Tape under frame for lead frame IC package assembly | David J. Corisis, Larry D. Kinsman | 2003-02-11 |
| 6506629 | Varied-thickness heat sink for integrated circuit (IC) packages and method of fabricating IC packages | Larry D. Kinsman | 2003-01-14 |
| 6492728 | Vertical surface mount assembly | Larry D. Kinsman, Warren M. Farnworth, Walter L. Moden, Terry R. Lee | 2002-12-10 |
| 6486546 | Low profile multi-IC chip package connector | Walter L. Moden, Jerrold L. King | 2002-11-26 |
| 6475831 | Methods for a low profile multi-IC chip package connector | Walter L. Moden, Jerrold L. King | 2002-11-05 |
| 6465275 | Method of forming a stack of packaged memory die and resulting apparatus | Jerrold L. King | 2002-10-15 |
| 6457985 | Locking assembly for securing semiconductor device to carrier substrate | David J. Corisis, Terry R. Lee | 2002-10-01 |
| 6455928 | Stackable ball grid array package | David J. Corisis, Walter L. Moden | 2002-09-24 |
| 6455351 | Vertical surface mount assembly and methods | Larry D. Kinsman, Warren M. Farnworth, Walter L. Moden, Terry R. Lee | 2002-09-24 |
| 6445067 | Integrated circuit package electrical enhancement | David J. Corisis | 2002-09-03 |
| 6445063 | Method of forming a stack of packaged memory die and resulting apparatus | Jerrold L. King | 2002-09-03 |
| 6445060 | Coated semiconductor die/leadframe assembly and method for coating the assembly | Robert Courtenay | 2002-09-03 |
| 6438045 | Redundancy mapping in a multichip semiconductor package | Jerrold L. King | 2002-08-20 |
| 6429528 | Multichip semiconductor package | Jerrold L. King | 2002-08-06 |
| 6418023 | Vertical surface mount apparatus with thermal carrier | Larry D. Kinsman, Walter L. Moden | 2002-07-09 |
| 6404044 | Semiconductor package with stacked substrates and multiple semiconductor dice | Salman Akram | 2002-06-11 |
| 6398573 | Locking assembly for securing semiconductor device to carrier substrate | David J. Corisis, Terry R. Lee | 2002-06-04 |