Issued Patents All Time
Showing 126–150 of 170 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6225689 | Low profile multi-IC chip package connector | Walter L. Moden, Jerrold L. King | 2001-05-01 |
| 6222265 | Method of constructing stacked packages | Salman Akram | 2001-04-24 |
| 6215183 | Vertical surface mount assembly and methods | Larry D. Kinsman, Warren M. Farnworth, Walter L. Moden, Terry R. Lee | 2001-04-10 |
| 6215177 | Tape under frame for conventional-type IC package assembly | David J. Corisis, Larry D. Kinsman | 2001-04-10 |
| 6207474 | Method of forming a stack of packaged memory die and resulting apparatus | Jerrold L. King | 2001-03-27 |
| 6159764 | Varied-thickness heat sink for integrated circuit (IC) packages and method of fabricating IC packages | Larry D. Kinsman | 2000-12-12 |
| 6153929 | Low profile multi-IC package connector | Walter L. Moden, Jerrold L. King | 2000-11-28 |
| 6148509 | Method for supporting an integrated circuit die | Aaron Schoenfeld | 2000-11-21 |
| 6146922 | Hybrid frame with lead-lock tape | Larry D. Kinsman, Timothy J. Allen | 2000-11-14 |
| 6143589 | Tape under frame for conventional-type IC package assembly | David J. Corisis, Larry D. Kinsman | 2000-11-07 |
| 6140154 | Multi-part lead frame with dissimilar materials and method of manufacturing | S. Hinkle, David J. Corisis | 2000-10-31 |
| 6134111 | Vertical surface mount apparatus with thermal carrier | Larry D. Kinsman, Walter L. Moden | 2000-10-17 |
| 6115254 | Vertical surface mount apparatus with thermal carrier | Larry D. Kinsman, Walter L. Moden | 2000-09-05 |
| 6107690 | Coated semiconductor die/leadframe assembly and method for coating the assembly | Robert Courtenay | 2000-08-22 |
| 6107677 | Interdigitated leads-over-chip lead frame, device, and method for supporting an integrated circuit die | Aaron Schoenfeld | 2000-08-22 |
| 6091133 | Assembly of a semiconductor device and paddleless lead frame having tape extending between the lead fingers | David J. Corisis, Larry D. Kinsman | 2000-07-18 |
| 6087720 | Integrated circuit package electrical enhancement | David J. Corisis | 2000-07-11 |
| 6087723 | Vertical surface mount assembly and methods | Larry D. Kinsman, Warren M. Farnworth, Walter L. Moden, Terry R. Lee | 2000-07-11 |
| 6084297 | Cavity ball grid array apparatus | Steven G. Thummel | 2000-07-04 |
| 6083777 | Reduced stress LOC assembly | Jerrold L. King, Larry D. Kinsman, David J. Corisis | 2000-07-04 |
| 6072233 | Stackable ball grid array package | David J. Corisis, Walter L. Moden | 2000-06-06 |
| 6072228 | Multi-part lead frame with dissimilar materials and method of manufacturing | S. Hinkle, David J. Corisis | 2000-06-06 |
| 6071139 | Locking assembly for securing semiconductor device to carrier substrate | David J. Corisis, Terry R. Lee | 2000-06-06 |
| 6063650 | Reduced stress LOC assembly | Jerrold L. King, Larry D. Kinsman, David J. Corisis | 2000-05-16 |
| 6052289 | Interdigitated leads-over-chip lead frame for supporting an integrated circuit die | Aaron Schoenfeld | 2000-04-18 |