Issued Patents All Time
Showing 101–125 of 170 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6396131 | Stress reduction feature for LOC lead frame | Larry D. Kinsman, Timothy J. Allen | 2002-05-28 |
| 6368136 | Locking assembly for securing semiconductor device to carrier substrate | David J. Corisis, Terry R. Lee | 2002-04-09 |
| 6362519 | Low profile multi-IC chip package connector | Walter L. Moden, Jerrold L. King | 2002-03-26 |
| 6362022 | Multi-part lead frame with dissimilar materials and method of manufacturing | S. Hinkle, David J. Corisis | 2002-03-26 |
| 6344976 | Interdigitated leads-over-chip lead frame device and method for supporting an integrated circuit die | Aaron Schoenfeld | 2002-02-05 |
| 6331939 | Stackable ball grid array package | David J. Corisis, Walter L. Moden | 2001-12-18 |
| 6329221 | Method of forming a stack of packaged memory die and resulting apparatus | Jerrold L. King | 2001-12-11 |
| 6330159 | Vertical surface mount apparatus with thermal carrier | Larry D. Kinsman, Walter L. Moden | 2001-12-11 |
| 6329710 | Integrated circuit package electrical enhancement | David J. Corisis | 2001-12-11 |
| 6326244 | Method of making a cavity ball grid array apparatus | Steven G. Thummel | 2001-12-04 |
| 6313522 | Semiconductor structure having stacked semiconductor devices | Salman Akram | 2001-11-06 |
| 6306687 | Tape under frame for conventional-type IC package assembly | David J. Corisis, Larry D. Kinsman | 2001-10-23 |
| 6302719 | Locking assembly for securing semiconductor device to carrier substrate | David J. Corisis, Terry R. Lee | 2001-10-16 |
| 6285070 | Method of forming semiconductor die with integral decoupling capacitor | David J. Corisis | 2001-09-04 |
| 6284571 | Lead frame assemblies with voltage reference plane and IC packages including same | David J. Corisis, Terry R. Lee | 2001-09-04 |
| 6277225 | Stress reduction feature for LOC lead frame | Larry D. Kinsman, Timothy J. Allen | 2001-08-21 |
| 6271582 | Interdigitated leads-over-chip lead frame, device, and method for supporting an integrated circuit die | Aaron Schoenfeld | 2001-08-07 |
| 6268649 | Stackable ball grid array package | David J. Corisis, Walter L. Moden | 2001-07-31 |
| 6258623 | Low profile multi-IC chip package connector | Walter L. Moden, Jerrold L. King | 2001-07-10 |
| 6251708 | Hybrid frame with lead-lock tape | Larry D. Kinsman, Timothy J. Allen | 2001-06-26 |
| 6246615 | Redundancy mapping in a multichip semiconductor package | Jerrold L. King | 2001-06-12 |
| 6238228 | Locking assembly for securing semiconductor device to carrier substrate | David J. Corisis, Terry R. Lee | 2001-05-29 |
| 6232213 | Method of making a semiconductor chip package | Jerrold L. King | 2001-05-15 |
| 6228677 | Vertical surface mount assembly and methods | Larry D. Kinsman, Warren M. Farnworth, Walter L. Moden, Terry R. Lee | 2001-05-08 |
| 6228548 | Method of making a multichip semiconductor package | Jerold L. King | 2001-05-08 |