Issued Patents All Time
Showing 26–50 of 55 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6525408 | Collar positionable about a periphery of a contact pad and around a conductive structure secured to the contact pads, semiconductor device components including same, and methods for fabricating same | Salman Akram | 2003-02-25 |
| 6506628 | Method of attaching a leadframe to singulated semiconductor dice | Tongbi Jiang, Walter L. Moden | 2003-01-14 |
| 6500697 | Leadframes including offsets extending from a major plane thereof, packaged semiconductor devices including same, and methods of designing and fabricating such leadframes | — | 2002-12-31 |
| 6492713 | Gravitationally assisted control of spread of viscous material applied to semiconductor assembly components | Tongbi Jiang | 2002-12-10 |
| 6489681 | Gravitationally-assisted control of spread of viscous material applied to semiconductor assembly components | Tongbi Jiang | 2002-12-03 |
| 6485778 | Method of applying an adhesive material to lead fingers of a lead frame | Walter L. Moden, Gregory M. Chapman, Tongbi Jiang | 2002-11-26 |
| 6483044 | Interconnecting substrates for electrical coupling of microelectronic components | — | 2002-11-19 |
| 6436732 | Apparatus for applying viscous materials to a lead frame | — | 2002-08-20 |
| 6353326 | Test carrier with molded interconnect for testing semiconductor components | David R. Hembree, Salman Akram, Warren M. Farnworth, Alan G. Wood, Derek Gochnour +2 more | 2002-03-05 |
| 6346152 | Method and apparatus for applying adhesives to a lead frame | Walter L. Moden, Gregory M. Chapman, Tongbi Jiang | 2002-02-12 |
| 6336973 | Apparatus and method for modifying the configuration of an exposed surface of a viscous fluid | Walter L. Moden, Gregory M. Chapman, Tongbi Jiang | 2002-01-08 |
| 6336974 | Apparatus and method for controlling the depth of immersion of a semiconductor element in an exposed surface of a viscous fluid | — | 2002-01-08 |
| 6331448 | Leadframes including offsets extending from a major plane thereof, packaged semiconductor devices including same, and methods of designing and fabricating such leadframes | — | 2001-12-18 |
| 6329705 | Leadframes including offsets extending from a major plane thereof, packaged semiconductor devices including same, and method of designing and fabricating such leadframes | — | 2001-12-11 |
| 6316952 | Flexible conductive structures and method | Salman Akram | 2001-11-13 |
| 6312977 | Method of attaching a leadframe to singulated semiconductor dice | Tongbi Jiang, Walter L. Moden | 2001-11-06 |
| 6204093 | Method and apparatus for applying viscous materials to a lead frame | — | 2001-03-20 |
| 6200832 | Apparatus for applying viscous materials to a lead frame | — | 2001-03-13 |
| 6200833 | Method of attaching a leadframe to singulated semiconductor dice | Tongbi Jiang, Walter L. Moden | 2001-03-13 |
| 6194251 | Die positioning in integrated circuit packaging | — | 2001-02-27 |
| 6110761 | Methods for simultaneously electrically and mechanically attaching lead frames to semiconductor dice and the resulting elements | — | 2000-08-29 |
| 6083768 | Gravitationally-assisted control of spread of viscous material applied to semiconductor assembly components | Tongbi Jiang | 2000-07-04 |
| 6040205 | Apparatus and method for controlling the depth of immersion of a semiconductor element in an exposed surface of a viscous fluid | — | 2000-03-21 |
| 6017776 | Method of attaching a leadframe to singulated semiconductor dice | Tongbi Jiang, Walter L. Moden | 2000-01-25 |
| 6013535 | Method for applying adhesives to a lead frame | Walter L. Moden, Gregory M. Chapman, Tongbi Jiang | 2000-01-11 |