Issued Patents All Time
Showing 26–50 of 78 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6531339 | Redundancy mapping in a multichip semiconductor package | Jerry M. Brooks | 2003-03-11 |
| 6489186 | Adhesion enhanced semiconductor die for mold compound packaging | J. Mike Brooks, Walter L. Moden | 2002-12-03 |
| 6486546 | Low profile multi-IC chip package connector | Walter L. Moden, Jerry M. Brooks | 2002-11-26 |
| 6475831 | Methods for a low profile multi-IC chip package connector | Walter L. Moden, Jerry M. Brooks | 2002-11-05 |
| 6465275 | Method of forming a stack of packaged memory die and resulting apparatus | Jerry M. Brooks | 2002-10-15 |
| 6445063 | Method of forming a stack of packaged memory die and resulting apparatus | Jerry M. Brooks | 2002-09-03 |
| 6438045 | Redundancy mapping in a multichip semiconductor package | Jerry M. Brooks | 2002-08-20 |
| 6429528 | Multichip semiconductor package | Jerry M. Brooks | 2002-08-06 |
| 6420195 | Method of aligning and testing a semiconductor chip package | Leland R. Nevill | 2002-07-16 |
| 6420214 | Method of forming an integrated circuit device having cyanate ester buffer coat | J. Mike Brooks, Kevin Schofield | 2002-07-16 |
| 6410859 | Electrical assembly for semiconductor dice | — | 2002-06-25 |
| 6362519 | Low profile multi-IC chip package connector | Walter L. Moden, Jerry M. Brooks | 2002-03-26 |
| 6329221 | Method of forming a stack of packaged memory die and resulting apparatus | Jerry M. Brooks | 2001-12-11 |
| 6323543 | Plastic lead frames for semiconductor devices, packages including same, and methods of fabrication | Tongbi Jiang | 2001-11-27 |
| 6316824 | Plastic leads frames for semiconductor devices | Tongbi Jiang | 2001-11-13 |
| 6316292 | Adhesion enhanced semiconductor die for mold compound packaging | J. Mike Brooks, Walter L. Moden | 2001-11-13 |
| 6294410 | Plastic lead frames for semiconductor devices, packages including same, and methods of fabrication | Tongbi Jiang | 2001-09-25 |
| 6258623 | Low profile multi-IC chip package connector | Walter L. Moden, Jerry M. Brooks | 2001-07-10 |
| 6246615 | Redundancy mapping in a multichip semiconductor package | Jerry M. Brooks | 2001-06-12 |
| 6246108 | Integrated circuit package including lead frame with electrically isolated alignment feature | David J. Corisis, Tracy V. Reynolds, Michael Slaughter, Daniel P. Cram, Leland R. Nevill | 2001-06-12 |
| 6233154 | Single-piece molded module housing | Warren M. Farnworth | 2001-05-15 |
| 6232213 | Method of making a semiconductor chip package | Jerry M. Brooks | 2001-05-15 |
| 6225689 | Low profile multi-IC chip package connector | Walter L. Moden, Jerry M. Brooks | 2001-05-01 |
| 6208027 | Temporary interconnect for semiconductor devices | Mohammad Khan | 2001-03-27 |
| 6207474 | Method of forming a stack of packaged memory die and resulting apparatus | Jerry M. Brooks | 2001-03-27 |