Issued Patents All Time
Showing 76–100 of 109 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7467977 | Electrical connector with additional mating port | Chong Hun Yi, Kuan-Yu Chen | 2008-12-23 |
| 7446398 | Bump pattern design for flip chip semiconductor package | Pao-Kang Niu, Hao-Yi Tsai, Yung Kuan Hsiao, Chung Yu Wang, Shang-Yun Hou +1 more | 2008-11-04 |
| 7443010 | Matrix form semiconductor package substrate having an electrode of serpentine shape | Chender Huang, Chung Yu Wang | 2008-10-28 |
| 7435132 | Cable connector assembly with improved grounding member | Jen-Guo Fong, Eric (Yun-chien) Lin, Joseph Tang, An-Jen Yang, Tien-Lu Kao +4 more | 2008-10-14 |
| 7397127 | Bonding and probing pad structures | Liang-Chen Lin | 2008-07-08 |
| 7390697 | Enhanced adhesion strength between mold resin and polyimide | Ken-Ching Chen, Chender Huang, Jones Wang, Hank Huang | 2008-06-24 |
| 7378731 | Heat spreader and package structure utilizing the same | Chender Huang, Allan Lin, Jeffrey Hsu | 2008-05-27 |
| 7294937 | Apparatus and method for manufacturing a semiconductor wafer with reduced delamination and peeling | Chao-Yuan Su, Hsin-Hui Lee, Chender Huang, Shang Y. Hou, Shin-Puu Jeng +2 more | 2007-11-13 |
| 7190066 | Heat spreader and package structure utilizing the same | Chender Huang, Allan Lin, Jeffrey Hsu | 2007-03-13 |
| 7157734 | Semiconductor bond pad structures and methods of manufacturing thereof | Chender Huang, Shang Y. Hou, Chao-Yuan Su, Chia-Hsiung Hsu | 2007-01-02 |
| 7126225 | Apparatus and method for manufacturing a semiconductor wafer with reduced delamination and peeling | Chao-Yuan Su, Hsin-Hui Lee, Chender Huang, Shang Y. Hou, Shin-Puu Jeng +2 more | 2006-10-24 |
| 7112522 | Method to increase bump height and achieve robust bump structure | Clinton Chao, Chung Yu Wang | 2006-09-26 |
| 7105379 | Implementation of protection layer for bond pad protection | Jan-Her Horng, Cheng-Chung Chang | 2006-09-12 |
| 7105920 | Substrate design to improve chip package reliability | Chao-Yuan Su, Chen-Der Huang, Chuen-Jye Lin | 2006-09-12 |
| 7015066 | Method for stress reduction in flip chip bump during flip chip mounting and underfill process steps of making a microelectronic assembly | Chender Huang, Jones Wang, Ken-Ching Chen | 2006-03-21 |
| 6960518 | Buildup substrate pad pre-solder bump manufacturing | Chender Huang, Jones Wang, Ken-Ching Chen, Hank Huang | 2005-11-01 |
| 6939789 | Method of wafer level chip scale packaging | Chender Huang, Jones Wang, Ken-Ching Chen | 2005-09-06 |
| 6884662 | Enhanced adhesion strength between mold resin and polyimide | Ken-Ching Chen, Chender Huang, Jones Wang, Hank Huang | 2005-04-26 |
| 6787926 | Wire stitch bond on an integrated circuit bond pad and method of making the same | Chih-Chiang Chen, Chung Yu Wang | 2004-09-07 |
| 6782897 | Method of protecting a passivation layer during solder bump formation | Chung Yu Wang, Chender Huang, Ken-Ching Chen, Hank Huang | 2004-08-31 |
| 6774026 | Structure and method for low-stress concentration solder bumps | Chung Yu Wang, Chender Huang, Ken-Ching Chen, Hank Huang | 2004-08-10 |
| 6770958 | Under bump metallization structure | Chung Yu Wang, Chender Huang, Ken-Ching Chen, Hank Huang | 2004-08-03 |
| 6656827 | Electrical performance enhanced wafer level chip scale package with ground | Chender Huang, Jones Wang, Ken-Ching Chen, Hank Huang | 2003-12-02 |
| 6638837 | Method for protecting the front side of semiconductor wafers | Chender Huang, Jones Wang, Ken-Ching Chen, Hank Huang | 2003-10-28 |
| 6630624 | Electrical cable with grounding means | Frank Quach | 2003-10-07 |