Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7105920 | Substrate design to improve chip package reliability | Chao-Yuan Su, Pei-Haw Tsao, Chuen-Jye Lin | 2006-09-12 |
| 6323541 | Structure for manufacturing a semiconductor die with copper plated tapes | Hsing-Hai Chen | 2001-11-27 |