Issued Patents All Time
Showing 26–50 of 109 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11081392 | Dicing method for stacked semiconductor devices | Tsung-Hsing Lu, Jun He, Li-Huan Chu | 2021-08-03 |
| 11037849 | Semiconductor structure and manufacturing method thereof | Chien-Jung Wang | 2021-06-15 |
| 11018099 | Semiconductor structure having a conductive bump with a plurality of bump segments | An Xu, Huang-Ting Hsiao, Kuo-Chin Chang | 2021-05-25 |
| 10912194 | Printed circuit board | Tsung-Hsing Lu, Li-Huan Chu | 2021-02-02 |
| 10892230 | Magnetic shielding material with insulator-coated ferromagnetic particles | Tsung-Hsing Lu, Li-Huan Chu | 2021-01-12 |
| 10879098 | Semiconductor chip holder | Tsung-Jen Liao, Tsui-Mei Chen, Yu-Jung LIN, Ju-Min Chen, Sean Xuan Lin | 2020-12-29 |
| 10867881 | Package and printed circuit board attachment | Tsung-Hsing Lu, Li-Huan Chu | 2020-12-15 |
| 10692828 | Package structure with protrusion structure | Chen-Shien Chen, Li-Huan Chu | 2020-06-23 |
| 10679877 | Carrier tape system and methods of using carrier tape system | Tsung-Jen Liao, Tsui-Mei Chen | 2020-06-09 |
| 10510633 | Package and printed circuit board attachment | Tsung-Hsing Lu, Li-Huan Chu | 2019-12-17 |
| 10506712 | Printed circuit board | Tsung-Hsing Lu, Li-Huan Chu | 2019-12-10 |
| 10475719 | Semiconductor structure and manufacturing method thereof | Chien-Jung Wang | 2019-11-12 |
| 10373901 | Semiconductor structure and manufacturing method thereof | Tsung-Hsing Lu, Li-Huan Chu | 2019-08-06 |
| 10304793 | Package structure and method for forming the same | Tsung-Hsing Lu | 2019-05-28 |
| 10283424 | Wafer structure and packaging method | Tsui-Mei Chen, Cheng-Te Lin, Yu-Jung LIN, Li-Huan Chu | 2019-05-07 |
| 10163827 | Package structure with protrusion structure | Chen-Shien Chen, Li-Huan Chu | 2018-12-25 |
| 10020239 | Semiconductor structure and manufacturing method thereof | Chien-Jung Wang | 2018-07-10 |
| 9880220 | Edge crack detection system | Huang-Ting Hsiao, An Xu, Cheng-Hung Tsai, Tsui-Mei Chen, Nai-Cheng Lu | 2018-01-30 |
| 9859235 | Underbump metallization structure | Yu-Wen Liu, Hao-Yi Tsai, Hsien-Wei Chen, Shin-Puu Jeng, Ying-Ju Chen +2 more | 2018-01-02 |
| 9780046 | Seal rings structures in semiconductor device interconnect layers and methods of forming the same | Hsin-Yu Pan, Han-Ping Pu, Yu-Chen Hsu | 2017-10-03 |
| 9525227 | Flippable electrical connector | Terrance F. Little, Chih-Pi Cheng, Stephen Sedio, Chun-Yi Chang, Wei-Hao Su | 2016-12-20 |
| 9454684 | Edge crack detection system | Huang-Ting Hsiao, An Xu, Cheng-Hung Tsai, Tsui-Mei Chen, Nai-Cheng Lu | 2016-09-27 |
| 9136211 | Protected solder ball joints in wafer level chip-scale packaging | Chung Yu Wang, Chien-Hsun Lee, Kuo-Chin Chang, Chung-Yi Lin, Bill Kiang | 2015-09-15 |
| 8961038 | Integrated and sealed opto-electronic device assembly | Jim Zhao, Yuan-Chieh Lin, An-Jen Yang, Yin-Tse Kao, Ashish Raheja | 2015-02-24 |
| 8685834 | Fabrication method of package structure with simplified encapsulation structure and simplified wiring | Chender Huang, Chuen-Jye Lin | 2014-04-01 |