Issued Patents All Time
Showing 26–50 of 55 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10510654 | Dummy metal with zigzagged edges | Hsien-Wei Chen, Chi-Hsi Wu, Chen-Hua Yu, Der-Chyang Yeh, Li-Han Hsu +1 more | 2019-12-17 |
| 10504751 | Package structures and method of forming the same | Hsien-Wei Chen, Li-Han Hsu, Lai Wei Chih | 2019-12-10 |
| 10504877 | Surface mount device/integrated passive device on package or device structure and methods of forming | Hsien-Wei Chen, Chi-Hsi Wu, Chen-Hua Yu, Der-Chyang Yeh, Wei-Cheng Wu | 2019-12-10 |
| 10475768 | Redistribution layers in semiconductor packages and methods of forming same | Li-Han Hsu, Wei-Cheng Wu, Hsien-Wei Chen, Der-Chyang Yeh, Chi-Hsi Wu +1 more | 2019-11-12 |
| 10416566 | Optimization of source and bandwidth for new and existing patterning devices | Willard E. Conley, Wei-An Hsieh, Tsann-Bim Chiou | 2019-09-17 |
| 10319681 | Dummy features in redistribution layers (RDLS) and methods of forming same | Li-Han Hsu, Wei-Cheng Wu, Hsien-Wei Chen, Der-Chyang Yeh, Chi-Hsi Wu +1 more | 2019-06-11 |
| 10290584 | Conductive vias in semiconductor packages and methods of forming same | Li-Han Hsu, Wei-Cheng Wu, Hsien-Wei Chen, Der-Chyang Yeh, Chi-Hsi Wu +1 more | 2019-05-14 |
| 10276532 | Three-dimensional chip stack and method of forming the same | Wei-Ming Chen, Sung-Hui Huang, Kuo-Ching Hsu | 2019-04-30 |
| 10269738 | Semiconductor device and method of manufacture | Hsien-Wei Chen, Chen-Hua Yu, Tsung-Shu Lin, Wei-Cheng Wu | 2019-04-23 |
| 10269584 | 3D packages and methods for forming the same | Tzu-Wei Chiu, Hsien-Pin Hu, Kuo-Ching Hsu, Shang-Yun Hou, Shin-Puu Jeng | 2019-04-23 |
| 10163805 | Package structure and method for forming the same | Li-Han Hsu, Wei-Cheng Wu, Hsien-Wei Chen, Der-Chyang Yeh, Chi-Hsi Wu | 2018-12-25 |
| 10165682 | Opening in the pad for bonding integrated passive device in InFO package | Chi-Hsi Wu, Chen-Hua Yu, Der-Chyang Yeh, Hsien-Wei Chen, Li-Han Hsu +1 more | 2018-12-25 |
| 10157825 | Dummy metal with zigzagged edges | Hsien-Wei Chen, Chi-Hsi Wu, Chen-Hua Yu, Der-Chyang Yeh, Li-Han Hsu +1 more | 2018-12-18 |
| 10141288 | Surface mount device/integrated passive device on package or device structure and methods of forming | Hsien-Wei Chen, Chi-Hsi Wu, Chen-Hua Yu, Der-Chyang Yeh, Wei-Cheng Wu | 2018-11-27 |
| 10109607 | Under bump metallurgy (UBM) and methods of forming same | Wei-Yu Chen, Hsien-Wei Chen, An-Jhih Su | 2018-10-23 |
| 10062648 | Semiconductor package and method of forming the same | Li-Han Hsu, Wei-Cheng Wu, Hsien-Wei Chen, Der-Chyang Yeh, Chi-Hsi Wu +2 more | 2018-08-28 |
| 10032651 | Package structures and method of forming the same | Hsien-Wei Chen, Li-Han Hsu, Lai Wei Chih | 2018-07-24 |
| 9997464 | Dummy features in redistribution layers (RDLS) and methods of forming same | Li-Han Hsu, Wei-Cheng Wu, Hsien-Wei Chen, Der-Chyang Yeh, Chi-Hsi Wu +1 more | 2018-06-12 |
| 9929112 | Semiconductor device and method of manufacture | Hsien-Wei Chen, Chen-Hua Yu, Tsung-Shu Lin, Wei-Cheng Wu | 2018-03-27 |
| 9812426 | Integrated fan-out package, semiconductor device, and method of fabricating the same | Chin-Te Wang, Hsien-Wei Chen, Li-Han Hsu, Tzu-Shiun Sheu, Wei-Cheng Wu +1 more | 2017-11-07 |
| 9793231 | Under bump metallurgy (UBM) and methods of forming same | Wei-Yu Chen, Hsien-Wei Chen, An-Jhih Su | 2017-10-17 |
| 9741690 | Redistribution layers in semiconductor packages and methods of forming same | Li-Han Hsu, Wei-Cheng Wu, Hsien-Wei Chen, Der-Chyang Yeh, Chi-Hsi Wu +1 more | 2017-08-22 |
| 9698115 | Three-dimensional chip stack and method of forming the same | Wei-Ming Chen, Sung-Hui Huang, Kuo-Ching Hsu | 2017-07-04 |
| 9640496 | Semiconductor device | Wei-Yu Chen, Hsien-Wei Chen, An-Jhih Su | 2017-05-02 |
| 9627288 | Package structures and methods of forming the same | Hsien-Wei Chen, Wei-Yu Chen | 2017-04-18 |