Issued Patents All Time
Showing 26–34 of 34 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9449933 | Packaging device and method of making the same | Tsung-Shu Lin, Ming-Da Cheng, Wen-Hsiung Lu, Bor-Rung Su | 2016-09-20 |
| 9209046 | Semiconductor device and manufacturing method thereof | Yu-Chih Liu, Shih-Yen Lin, Chin-Liang Chen, Kuan-Lin Ho, Wei-Ting Lin | 2015-12-08 |
| 9165796 | Methods and apparatus for bump-on-trace chip packaging | Yen-Liang Lin, Tin-Hao Kuo, Sheng-Yu Wu, Chen-Shien Chen | 2015-10-20 |
| 9105530 | Conductive contacts having varying widths and method of manufacturing same | Yen-Liang Lin, Yu-Jen Tseng, Tin-Hao Kuo, Chen-Shien Chen | 2015-08-11 |
| 8987915 | Semiconductor structure and manufacturing method thereof | Chen-Hua Yu, Mirng-Ji Lii, Chung-Shi Liu, Chih-Wei Lin, Ming-Da Cheng | 2015-03-24 |
| 8922006 | Elongated bumps in integrated circuit devices | Yen-Liang Lin, Chen-Shien Chen, Tin-Hao Kuo, Sheng-Yu Wu, Tsung-Shu Lin | 2014-12-30 |
| 8883628 | Electrical connection structure | Yao-Chun Chuang, Tsung-Shu Lin, Chen-Cheng Kuo, Chen-Shien Chen | 2014-11-11 |
| 8866285 | Fan-out package comprising bulk metal | Yen-Chang Hu, Ching-Wen Hsiao, Chen-Shien Chen | 2014-10-21 |
| 8476759 | Electrical connection structure | Yao-Chun Chuang, Tsung-Shu Lin, Chen-Cheng Kuo, Chen-Shien Chen | 2013-07-02 |