Issued Patents All Time
Showing 1–18 of 18 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11133274 | Fan-out interconnect structure and method for forming same | Chen-Hua Yu, Ching-Wen Hsiao, Mirng-Ji Lii, Chung-Shi Liu, Chien Ling Hwang +2 more | 2021-09-28 |
| 11101192 | Wafer level embedded heat spreader | Wei Sen Chang, Tsung-Hsien Chiang, Ching-Wen Hsiao | 2021-08-24 |
| 10700025 | Fan-out interconnect structure and method for forming same | Chen-Hua Yu, Ching-Wen Hsiao, Mirng-Ji Lii, Chung-Shi Liu, Chien Ling Hwang +2 more | 2020-06-30 |
| 10177073 | Wafer level embedded heat spreader | Wei Sen Chang, Tsung-Hsien Chiang, Ching-Wen Hsiao | 2019-01-08 |
| 10157884 | 3D die stacking structure with fine pitches | Chen-Hua Yu, Chen-Shien Chen | 2018-12-18 |
| 9991190 | Packaging with interposer frame | Hui-Min Huang, Chih-Wei Lin, Ming-Da Cheng, Chung-Shi Liu, Chen-Shien Chen | 2018-06-05 |
| 9799620 | Warpage reduction and adhesion improvement of semiconductor die package | Yu-Chih Huang, Ching-Wen Hsiao, Chen-Shien Chen | 2017-10-24 |
| 9735087 | Wafer level embedded heat spreader | Wei Sen Chang, Tsung-Hsien Chiang, Ching-Wen Hsiao | 2017-08-15 |
| 9418969 | Packaged semiconductor devices and packaging methods | Ching-Wen Hsiao, Chen-Shien Chen | 2016-08-16 |
| 9379078 | 3D die stacking structure with fine pitches | Chen-Hua Yu, Chen-Shien Chen | 2016-06-28 |
| 9368460 | Fan-out interconnect structure and method for forming same | Chen-Hua Yu, Ching-Wen Hsiao, Mirng-Ji Lii, Chung-Shi Liu, Chien Ling Hwang +2 more | 2016-06-14 |
| 9165887 | Semiconductor device with discrete blocks | Ching-Wen Hsiao, Chen-Shien Chen, Wei Sen Chang | 2015-10-20 |
| 9087832 | Warpage reduction and adhesion improvement of semiconductor die package | Yu-Chih Huang, Ching-Wen Hsiao, Chen-Shien Chen | 2015-07-21 |
| 9070667 | Peripheral electrical connection of package on package | Ching-Wen Hsiao, Chih-Wei Lin, Wei Sen Chang, Kuo Lung Pan, Yu-Chih Huang | 2015-06-30 |
| 9035461 | Packaged semiconductor devices and packaging methods | Ching-Wen Hsiao, Chen-Shien Chen | 2015-05-19 |
| 8922005 | Methods and apparatus for package on package devices with reversed stud bump through via interconnections | Ching-Wen Hsiao, Chih-Hua Chen, Chen-Shien Chen, Tin-Hao Kuo | 2014-12-30 |
| 8866285 | Fan-out package comprising bulk metal | Chang-Chia Huang, Ching-Wen Hsiao, Chen-Shien Chen | 2014-10-21 |
| 8816507 | Package-on-Package structures having buffer dams and method for forming the same | Ching-Wen Hsiao, Chen-Shien Chen | 2014-08-26 |