Issued Patents All Time
Showing 76–100 of 101 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9343433 | Packages with stacked dies and methods of forming the same | Chien-Hsun Lee, Mirng-Ji Lii, Chen-Hua Yu | 2016-05-17 |
| 9318465 | Methods for forming a semiconductor device package | Jung Wei Cheng, Chien-Hsun Lee, Chun-Chih Chuang | 2016-04-19 |
| 9275924 | Semiconductor package having a recess filled with a molding compound | Jung Wei Cheng, Bo-I Lee | 2016-03-01 |
| 9263377 | POP structures with dams encircling air gaps and methods for forming the same | Chen-Hua Yu, Chen-Shien Chen, Chung-Shi Liu, Jiun Yi Wu | 2016-02-16 |
| 9240387 | Wafer-level chip scale package with re-workable underfill | Hsien-Wei Chen, Chien-Hsiun Lee, Hao-Yi Tsai, Mirng-Ji Lii, Chen-Hua Yu | 2016-01-19 |
| 9219106 | Integrated inductor | Yen-Liang Lin, Mirng-Ji Lii, Chen-Shien Chen, Ching-Wen Hsiao | 2015-12-22 |
| 9177835 | Underfill dispensing with controlled fillet profile | Chun-Chih Chuang, Chun-Hung Lin, Jung Wei Cheng | 2015-11-03 |
| 9165876 | Package-on-package structure and methods for forming the same | Chien-Hsun Lee, Jung Wei Cheng, Hao-Cheng Hou, Jiun Yi Wu, Ming-Chung Sung | 2015-10-20 |
| 9117939 | Method of forming wafer-level molded structure for package assembly | Bo-I Lee, Chien-Hsun Lee | 2015-08-25 |
| 9059109 | Package assembly and method of forming the same | Hung-Jen Lin, Chien-Hsiun Lee, Wen-Hsiung Lu, Ming-Da Cheng, Chung-Shi Liu | 2015-06-16 |
| 9006032 | Package on package structures and methods for forming the same | Jung Wei Cheng, Chien-Hsun Lee, Chun-Chih Chuang | 2015-04-14 |
| 8987605 | Formation of connectors without UBM | Hung-Jen Lin, Chien-Hsiun Lee | 2015-03-24 |
| 8823180 | Package on package devices and methods of packaging semiconductor dies | Ming-Chung Sung, Jiun Yi Wu, Chien-Hsiun Lee, Mirng-Ji Lii | 2014-09-02 |
| 8803332 | Delamination resistance of stacked dies in die saw | Bo-I Lee | 2014-08-12 |
| 8803323 | Package structures and methods for forming the same | Chen-Hua Yu, Jiun Yi Wu | 2014-08-12 |
| 8743561 | Wafer-level molded structure for package assembly | Bo-I Lee, Chien-Hsiun Lee | 2014-06-03 |
| 8704354 | Package on package structures and methods for forming the same | Jung Wei Cheng, Chien-Hsun Lee, Chun-Chih Chuang | 2014-04-22 |
| 8691629 | Packaging jig and process for semiconductor packaging | Chi-Ming Huang | 2014-04-08 |
| 8658464 | Mold chase design for package-on-package applications | Jung Wei Cheng, Chien-Hsiun Lee, Chun-Chih Chuang | 2014-02-25 |
| 8629565 | Thin wafer protection device | Ku-Feng Yang, Weng-Jin Wu, Wen-Chih Chiou | 2014-01-14 |
| 8624360 | Cooling channels in 3DIC stacks | Kai-Ming Ching, Ching-Wen Hsiao, Ming-Hong Tseng, Chen-Shien Chen | 2014-01-07 |
| 8597986 | System in package and method of fabricating same | Chien-Hsiun Lee | 2013-12-03 |
| 8426256 | Method of forming stacked-die packages | C. W. Hsiao, Bo-I Lee, Kai-Ming Ching, Chen-Shien Chen, Chien-Hsiun Lee +1 more | 2013-04-23 |
| 8232140 | Method for ultra thin wafer handling and processing | Ku-Feng Yang, Weng-Jin Wu, Wen-Chih Chiou | 2012-07-31 |
| 8097953 | Three-dimensional integrated circuit stacking-joint interface structure | Ming-Hong Tseng, Kai-Ming Ching, Chen-Shien Chen, Ching-Wen Hsiao, Hon-Lin Huang | 2012-01-17 |