Issued Patents All Time
Showing 26–50 of 69 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10879138 | Semiconductor packaging structure including interconnection to probe pad with probe mark and method of manufacturing the same | Hsien-Wei Chen, Jie Chen | 2020-12-29 |
| 10879198 | Package with solder regions aligned to recesses | Hsien-Wei Chen, Hsien-Ming Tu, Chang-Pin Huang, Yu-Chia Lai, Tung-Liang Shao | 2020-12-29 |
| 10867968 | 3DIC structure with protective structure and method of fabricating the same | Hsien-Wei Chen, Ming-Fa Chen | 2020-12-15 |
| 10854564 | Semiconductor device and manufacturing method thereof | Tung-Liang Shao, Yu-Chia Lai, Hsien-Ming Tu, Chang-Pin Huang | 2020-12-01 |
| 10840190 | Semiconductor structure and manufacturing method thereof | Hsien-Wei Chen, Ming-Fa Chen | 2020-11-17 |
| 10825804 | Hollow metal pillar packaging scheme | Chang-Pin Huang, Hsien-Ming Tu, Hsien-Wei Chen, Tung-Liang Shao, Yu-Chia Lai | 2020-11-03 |
| 10658290 | Plurality of different size metal layers for a pad structure | Hsien-Wei Chen, Chia-Wei Tu | 2020-05-19 |
| 10636757 | Integrated circuit component package and method of fabricating the same | Ming-Yen Chiu | 2020-04-28 |
| 10504873 | 3DIC structure with protective structure and method of fabricating the same and package | Hsien-Wei Chen, Ming-Fa Chen | 2019-12-10 |
| 10354986 | Hollow metal pillar packaging scheme | Chang-Pin Huang, Hsien-Ming Tu, Hsien-Wei Chen, Tung-Liang Shao, Yu-Chia Lai | 2019-07-16 |
| 10276496 | Plurality of different size metal layers for a pad structure | Hsien-Wei Chen, Chia-Wei Tu | 2019-04-30 |
| 10269737 | Method for manufacturing semiconductor structure | Chang-Pin Huang, Hsien-Ming Tu, Shih-Wei Liang, Hung-Yi Kuo, Yu-Chia Lai +3 more | 2019-04-23 |
| 10262958 | Package with solder regions aligned to recesses | Hsien-Wei Chen, Hsien-Ming Tu, Chang-Pin Huang, Yu-Chia Lai, Tung-Liang Shao | 2019-04-16 |
| 10170444 | Packages for semiconductor devices, packaged semiconductor devices, and methods of packaging semiconductor devices | Yen-Ping Wang | 2019-01-01 |
| 10163828 | Semiconductor device and fabricating method thereof | Chang-Pin Huang, Tung-Liang Shao, Hsien-Ming Tu, Yu-Chia Lai | 2018-12-25 |
| 10032737 | Semiconductor device and manufacturing method thereof | Tung-Liang Shao, Yu-Chia Lai, Hsien-Ming Tu, Chang-Pin Huang | 2018-07-24 |
| 9947630 | Package with solder regions aligned to recesses | Hsien-Wei Chen, Hsien-Ming Tu, Chang-Pin Huang, Yu-Chia Lai, Tung-Liang Shao | 2018-04-17 |
| 9812434 | Hollow metal pillar packaging scheme | Chang-Pin Huang, Hsien-Ming Tu, Hsien-Wei Chen, Tung-Liang Shao, Yu-Chia Lai | 2017-11-07 |
| 9786618 | Semiconductor structure and manufacturing method thereof | Chang-Pin Huang, Hsien-Ming Tu, Shih-Wei Liang, Hung-Yi Kuo, Yu-Chia Lai +3 more | 2017-10-10 |
| 9773732 | Method and apparatus for packaging pad structure | Hsien-Wei Chen, Chia-Wei Tu | 2017-09-26 |
| 9679883 | Hollow metal pillar packaging scheme | Chang-Pin Huang, Hsien-Ming Tu, Hsien-Wei Chen, Tung-Liang Shao, Yu-Chia Lai | 2017-06-13 |
| 9673270 | Metal insulator metal capacitor and method for making the same | Yu-Chia Lai, Tung-Liang Shao | 2017-06-06 |
| 9646944 | Alignment structures and methods of forming same | Hsien-Wei Chen | 2017-05-09 |
| 9640498 | Integrated fan-out (InFO) package structures and methods of forming same | Chang-Pin Huang, Chen-Hua Yu, Chung-Shi Liu, Hsien-Ming Tu, Hung-Yi Kuo +3 more | 2017-05-02 |
| 9627332 | Integrated circuit structure and seal ring structure | Shih-Wei Liang, Hsien-Ming Tu, Chang-Pin Huang, Yu-Chia Lai | 2017-04-18 |