Issued Patents All Time
Showing 1–16 of 16 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10998277 | Guard ring method for semiconductor devices | Hsien-Wei Chen | 2021-05-04 |
| 10325864 | Guard ring method for semiconductor devices | Hsien-Wei Chen | 2019-06-18 |
| 9478505 | Guard ring design structure for semiconductor devices | Hsien-Wei Chen | 2016-10-25 |
| 9337117 | Chip package and method of manufacturing the same | Hsien-Wei Chen, Tsung-Yuan Yu, Shih-Wei Liang | 2016-05-10 |
| 9236322 | Methods and apparatus for heat spreader on silicon | Hsien-Wei Chen, Chao-Wen Shih, Kai-Chiang Wu | 2016-01-12 |
| 9117831 | Seal ring structure for integrated circuit chips | Ching-Jung Yang, Yu-Wen Liu, Michael Shou-Ming Tong, Hsien-Wei Chen, Tsung-Yuan Yu | 2015-08-25 |
| 9064939 | Methods of making integrated circuits | Hsien-Wei Chen | 2015-06-23 |
| 8957503 | Chip package and method of manufacturing the same | Hsien-Wei Chen, Tsung-Yuan Yu, Shih-Wei Liang | 2015-02-17 |
| 8796686 | Integrated circuits with leakage current test structure | Hsien-Wei Chen | 2014-08-05 |
| 8669651 | Package-on-package structures with reduced bump bridging | Chao-Wen Shih, Hao-Yi Tsai, Hsien-Wei Chen, Mirng-Ji Lii, Tzuan-Horng Liu | 2014-03-11 |
| 8624359 | Wafer level chip scale package and method of manufacturing the same | Hsien-Wei Chen, Tsung-Yuan Yu, Shih-Wei Liang | 2014-01-07 |
| 8395239 | Grounded seal ring structure in semiconductor devices | Hsien-Wei Chen | 2013-03-12 |
| 8253217 | Seal ring structure in semiconductor devices | Hsien-Wei Chen | 2012-08-28 |
| 8237160 | Probe pad on a corner stress relief region in a semiconductor chip | Hsien-Wei Chen, Ying-Ju Chen, Shih-Wei Liang, Ching-Jung Yang | 2012-08-07 |
| 8217394 | Probe pad on a corner stress relief region in a semiconductor chip | Hsien-Wei Chen | 2012-07-10 |
| 8217499 | Structure to reduce etching residue | Tsung-Yuan Yu, Hsien-Wei Chen | 2012-07-10 |