Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9117831 | Seal ring structure for integrated circuit chips | Ching-Jung Yang, Yu-Wen Liu, Hsien-Wei Chen, Chung-Ying Yang, Tsung-Yuan Yu | 2015-08-25 |
| 8963328 | Reducing delamination between an underfill and a buffer layer in a bond structure | Ching-Jung Yang, Chang-Pin Huang, Tzuan-Horng Liu, Ying-Ju Chen, Tung-Liang Shao +3 more | 2015-02-24 |
| 8610267 | Reducing delamination between an underfill and a buffer layer in a bond structure | Ching-Jung Yang, Chang-Pin Huang, Tzuan-Horng Liu, Ying-Ju Chen, Tung-Liang Shao +3 more | 2013-12-17 |