Issued Patents All Time
Showing 26–32 of 32 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6781392 | Modularized probe card with compressible electrical connection device | Shih-Jye Cheng, Yeong-Her Wang, Yuan-Ping Tseng, Yao-Jung Lee | 2004-08-24 |
| 6751760 | Method and system for performing memory repair analysis | Yuan-Ping Tseng, Vincent Wang, Linck Cheng | 2004-06-15 |
| 6686615 | Flip-chip type semiconductor device for reducing signal skew | S. Cheng, Yeong-Her Wang, Yuan-Ping Tseng, Y. Lee | 2004-02-03 |
| 6621710 | Modular probe card assembly | Shih-Jye Cheng, Yeong-Her Wang, Yuan-Ping Tseng, Yao-Jung Lee | 2003-09-16 |
| 6605480 | Wafer level packaging for making flip-chips | Yuan-Ping Tseng, Y. Lee | 2003-08-12 |
| 6534853 | Semiconductor wafer designed to avoid probed marks while testing | Yuan-Ping Tseng | 2003-03-18 |
| 6395622 | Manufacturing process of semiconductor devices | Yuan-Ping Tseng | 2002-05-28 |