| 8026615 |
IC package reducing wiring layers on substrate and its carrier |
Wu-Chang Tu, Cheng-Ting Wu |
2011-09-27 |
| 7952198 |
BGA package with leads on chip |
— |
2011-05-31 |
| 7879653 |
Leadless semiconductor package with electroplated layer embedded in encapsulant and the method for manufacturing the same |
— |
2011-02-01 |
| 7781898 |
IC package reducing wiring layers on substrate and its chip carrier |
Wu-Chang Tu, Cheng-Ting Wu |
2010-08-24 |
| 7663246 |
Stacked chip packaging with heat sink structure |
Yu-Ren Chen, Geng-Shin Shen |
2010-02-16 |
| 7662672 |
Manufacturing process of leadframe-based BGA packages |
— |
2010-02-16 |
| 7582953 |
Package structure with leadframe on offset chip-stacked structure |
— |
2009-09-01 |
| 7579676 |
Leadless leadframe implemented in a leadframe-based BGA package |
— |
2009-08-25 |
| 7479706 |
Chip package structure |
— |
2009-01-20 |