Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8026615 | IC package reducing wiring layers on substrate and its carrier | Wu-Chang Tu, Cheng-Ting Wu | 2011-09-27 |
| 7952198 | BGA package with leads on chip | — | 2011-05-31 |
| 7879653 | Leadless semiconductor package with electroplated layer embedded in encapsulant and the method for manufacturing the same | — | 2011-02-01 |
| 7781898 | IC package reducing wiring layers on substrate and its chip carrier | Wu-Chang Tu, Cheng-Ting Wu | 2010-08-24 |
| 7663246 | Stacked chip packaging with heat sink structure | Yu-Ren Chen, Geng-Shin Shen | 2010-02-16 |
| 7662672 | Manufacturing process of leadframe-based BGA packages | — | 2010-02-16 |
| 7582953 | Package structure with leadframe on offset chip-stacked structure | — | 2009-09-01 |
| 7579676 | Leadless leadframe implemented in a leadframe-based BGA package | — | 2009-08-25 |
| 7479706 | Chip package structure | — | 2009-01-20 |