Issued Patents All Time
Showing 51–55 of 55 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7560306 | Manufacturing process for chip package without core | Yu-Tang Pan, Chun-Hung Lin | 2009-07-14 |
| 7538419 | Stacked-type chip package structure | — | 2009-05-26 |
| 7504714 | Chip package with asymmetric molding | — | 2009-03-17 |
| 7446407 | Chip package structure | Chun-Hung Lin | 2008-11-04 |
| 7385282 | Stacked-type chip package structure | — | 2008-06-10 |