Issued Patents All Time
Showing 1–25 of 29 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10665277 | Timing calibration system and a method thereof | Shih-Chang Hsu | 2020-05-26 |
| 10002815 | Multi-chip package structure manufacturing process and wafer level chip package structure manufacturing process | — | 2018-06-19 |
| 9953960 | Manufacturing process of wafer level chip package structure having block structure | — | 2018-04-24 |
| 9735092 | Manufacturing method of chip package structure | Yu-Tang Pan | 2017-08-15 |
| 9728479 | Multi-chip package structure, wafer level chip package structure and manufacturing process thereof | — | 2017-08-08 |
| 9653429 | Multi-chip package structure having blocking structure, wafer level chip package structure having blocking structure and manufacturing process thereof | — | 2017-05-16 |
| 9437529 | Chip package structure and manufacturing method thereof | Yu-Tang Pan | 2016-09-06 |
| 9053968 | Semiconductor package structure and manufacturing method thereof | — | 2015-06-09 |
| 8772089 | Chip package structure and manufacturing method thereof | Yu-Tang Pan | 2014-07-08 |
| 8691630 | Semiconductor package structure and manufacturing method thereof | Yu-Tang Pan | 2014-04-08 |
| 8652882 | Chip package structure and chip packaging method | Yu-Tang Pan | 2014-02-18 |
| 8309401 | Method of manufacturing non-leaded package structure | — | 2012-11-13 |
| 8148827 | Quad flat no lead (QFN) package | Yu-Tang Pan | 2012-04-03 |
| 8105876 | Leadframe for leadless package, structure and manufacturing method using the same | Chun-Ying Lin, Geng-Shin Shen, Yu-Tang Pan | 2012-01-31 |
| 8106494 | Leadframe for leadless package, structure and manufacturing method using the same | Chun-Ying Lin, Geng-Shin Shen, Yu-Tang Pan | 2012-01-31 |
| RE42349 | Wafer treating method for making adhesive dies | Chun-Hung Lin, Jesse Huang, Kuang-Hui Chen | 2011-05-10 |
| 7919874 | Chip package without core and stacked chip package structure | Yu-Tang Pan, Cheng-Ting Wu, Hui Liu | 2011-04-05 |
| 7902649 | Leadframe for leadless package, structure and manufacturing method using the same | Chun-Ying Lin, Geng-Shin Shen, Yu-Tang Pan | 2011-03-08 |
| 7884486 | Chip-stacked package structure and method for manufacturing the same | Yu-Tang Pan | 2011-02-08 |
| 7851896 | Quad flat non-leaded chip package | Geng-Shin Shen, Chun-Ying Lin | 2010-12-14 |
| 7843054 | Chip package and manufacturing method thereof | — | 2010-11-30 |
| 7723853 | Chip package without core and stacked chip package structure | Yu-Tang Pan, Cheng-Ting Wu, Hui Liu | 2010-05-25 |
| 7696629 | Chip-stacked package structure | Chun-Ying Lin, Yu-Tang Pan, Geng-Shin Shen | 2010-04-13 |
| 7605461 | Chip package structure | Yu-Tang Pan | 2009-10-20 |
| 7592694 | Chip package and method of manufacturing the same | Yu-Tang Pan, Men-Shew Liu | 2009-09-22 |